PURPOSE OF THE ROLE
In a context where the number of qubits per dilution refrigerator keeps growing and no supplier offers an off-the-shelf readout bundle, the Mechanical Engineering Intern makes readout chain integration scalable. Today, each readout chain at the MXC stage (isolators/circulators, filters, TWPA, low-noise amplifier) is assembled line by line with SMA connections inside the fridge. This process is slow, depends on the operator, causes defects and cannot be outsourced.
Reporting to the Cryohardware Development Team, the intern will work closely with the operation and RF teams to design, prototype and validate a compact readout module that cuts assembly time and defects and that a subcontractor can build.
This internship will start at the end of January 2027 and will last 6 months!
Responsibilities:
- Characterize the current readout chain and define the specification
- Map the existing chain: assembly time, defect rate, insertion losses, footprint
- Define the specification with the operation and RF teams: number of lines (target 32), MXC envelope, insertion loss budget, thermalization requirements
- Study and select the mechanical architecture
- Compare two architectures: a pre-cabled block with non-threaded connections, and a block with a single plug interface to the MXC
- Benchmark compact components available on the market
- Build a decision matrix and defend the chosen architecture in design review
- Design the readout module
- Produce the CAD model, drawings and a costed bill of materials (BOM)
- Select materials and design thermalization to the MXC plate
- Define torque specifications and perform the SMP tolerance stack-up
- Choose connectors compatible with a future board-edge/PCB integration
- Write an assembly and inspection procedure that a subcontractor can follow
- Build and validate a prototype in the cryostat
- Assemble the prototype and measure the real assembly time
- Perform SOLT/SOLR calibration and S-parameter characterization at room temperature and cold
- Compare performance against the SMA reference chain and write a measurement report
- Recommend the path to industrialization
- Deliver a go/no-go recommendation based on measurement results
- Build an industrialization roadmap, including inputs for the phase-2 PCB study
Requirements:
- Mechanical design for assembly (DFA) and tolerance analysis (stack-ups)
- Proficiency in CAD (SolidWorks) and technical drawing
- Material selection and thermal design, ideally with an interest in cryogenic constraints
- Basic knowledge of RF connectors and coaxial lines (a plus)
- Interest in RF measurements (VNA, S-parameters) and cryogenics
- Hands-on approach: comfortable assembling and testing hardware
- Rigor and clear technical documentation
- Ability to structure and present technical choices in a design review
- LANGUAGES: Proficient in English
- EXPERIENCE: No minimum required. A previous internship or project in mechanical design, prototyping or testing is a plus. Availability: 6 months.
Final-year Master's or engineering student in mechanical engineering or mechatronics, with an interest in RF and cryogenic hardware. Hands-on and rigorous, you enjoys building, testing and documenting hardware and is comfortable presenting technical choices to multidisciplinary teams.
Skills Required
- Final-year Master's or engineering student in mechanical engineering or mechatronics
- Interest in RF and cryogenic hardware
- Mechanical design for assembly and tolerance analysis
- Proficiency in CAD, specifically SolidWorks, and technical drawing
- Material selection and thermal design knowledge
- Basic knowledge of RF connectors and coaxial lines
- Interest in RF measurements, VNA, S-parameters, and cryogenics
- Comfort assembling and testing hardware
- Rigor and clear technical documentation skills
- Ability to structure and present technical choices in design reviews
- Proficiency in English
- Availability for a six-month internship starting at the end of January 2027
- Previous internship or project in mechanical design, prototyping, or testing
What We Do
Founded in 2020, Alice & Bob secured $30 M funding in Series A. Today, we're recognized as one of the leaders in Quantum Computing. Our cat qubits are error corrected by design, reducing hardware requirements by up to 200 times compared to other platforms enabling fault-tolerant quantum computing at scale. Our headquarters is located in Paris, with offices in Boston, MA. We are 80+ smart and dedicated innovators, coming from 17+ countries and growing by the day. We are committed to one mission: build a useful quantum computer. Check open positions: bit.ly/joinusatAB
