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Job Description:A mechanical engineering position responsible for developing thermal management and robust socketing solutions for test and validation PCBs for Broadcom ASIC products targeted at hyperscale data center applications. Broadcom’s market leading products are enabling the next generation of AI and cloud storage.
Essential Duties and Responsibilities:
- Collaborate with PCB electrical design engineers to provide robust ASIC socket and thermal solutions for their designs.
- Perform mechanical component design and design verification using Solidworks.
- Perform 3d mechanical extractions from Allegro PCB design software.
- Interface with device package designers and generate device warpage profiles for socket designs from raw simulations data.
- Measure actual device warpage to validate warpage profile simulations using high precision profilometry equipment.
- Manage socket hardware vendors, review, provide feedback, and approve designs.
- Troubleshoot mechanical and electrical contact issues in lab and test floor environments.
- Design and review cooling solutions (air, liquid, cold plate) for test hardware.
- Evaluate and manage procurement of mechanical and test hardware such as thermal control units, socket resistance measurement platforms, etc.
- 3d print the team’s way out of headaches and usability issues.
The Successful Candidate Will:
- Have a strong sense of design ownership. You enjoy collaborating with the engineers using your mechanical solutions and working with them to generate improvements.
- Have good mechanical prototyping skills.
- Be extremely detail oriented.
- Be familiar with the issues involved in socketing and cooling very large, high power, high ball-count ASIC devices.
- Have experience with pogo-pin and elastomeric IC socket solutions.
- Have good mechanical debug intuition and be comfortable with all basic hand tools, micrometers, calipers, etc.
- Have base knowledge of ATE test hardware mechanical configurations.
- Have familiarity with Keyence profilometry equipment.
- Have skills in manipulating large data sets in tools such as Excel or in scripts in Python.
- Have a passion for continuous improvement and a commitment to creating quality output.
- Exhibit strong teamwork skills as part of a fast moving, multi-site team.
- Have excellent interpersonal skills and be comfortable managing vendors and internal team customers alike.
Qualifications:
- Bachelor’s Degree in Mechanical Engineering and 8+ years of experience (or a Master’s Degree + 6 years of experience) developing semiconductor socket and cooling solutions.
- In depth experience using Solidworks.
- Experience using Ansys Icepack and/or Solidworks FLOW thermal analysis and simulation software.
- Experience using Ansys mechanical simulation software.
- Experience managing vendors in the test hardware manufacturing process.
Compensation and Benefits
The annual base salary range for this position is USD 121,900.00 To USD 195,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Bachelor’s degree in Mechanical Engineering and 8+ years of experience developing semiconductor socket and cooling solutions
- Master’s degree in Mechanical Engineering and 6+ years of experience developing semiconductor socket and cooling solutions
- In-depth experience using SolidWorks
- Experience with Ansys Icepak and/or SolidWorks Flow thermal analysis and simulation software
- Experience using Ansys Mechanical simulation software
- Experience managing vendors in the test hardware manufacturing process
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.







