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The Role
Design and validate modular electromechanical chassis and rack-level systems for data centers (HPC/AI/Enterprise). Own product lifecycle through high-volume manufacturing, perform thermal/structural/vibration analysis using FEA, specify metal fabrication and liquid/power connector integration, and align across silicon, power, and optical teams.
Summary Generated by Built In
Requirements
Required Qualifications
- B.S. or M.S. in Mechanical Engineering.
- Design Experience: 12+ years in design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise segment.
- Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
- Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
- Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of drip-free connector integration.
- Proficiency in FEA tools for structural and vibration analysis.
- Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.
Preferred Qualifications
- Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
- Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
- Experience with blind-mate liquid and power interfaces.
Skills Required
- B.S. or M.S. in Mechanical Engineering.
- 12+ years design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise.
- Proven track record of owning at least one full product lifecycle from concept through high-volume manufacturing (HVM).
- Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
- Technical knowledge of fluid dynamics, wetted material compatibility, and mechanical nuances of drip-free connector integration.
- Proficiency in FEA tools for structural and vibration analysis.
- Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.
- Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
- Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
- Experience with blind-mate liquid and power interfaces.
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The Company
What We Do
Majestic Labs is reimagining AI infrastructure for the world’s most demanding workloads. Today, organizations are forced to overprovision expensive compute just to access the required memory their models need. We took a fundamentally different approach by pairing a massive amount of compute with 1000x the memory to create game changing improvements in performance, power and deployment efficiency. Our customers can literally replace racks of traditional AI infrastructure with a single Majestic server.
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