Mechanical Engineer – SoC to Rack Integration

Posted 21 Days Ago
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Los Altos, CA, USA
In-Office
Expert/Leader
Software
The Role
Design and validate modular electromechanical chassis and rack-level systems for data centers (HPC/AI/Enterprise). Own product lifecycle through high-volume manufacturing, perform thermal/structural/vibration analysis using FEA, specify metal fabrication and liquid/power connector integration, and align across silicon, power, and optical teams.
Summary Generated by Built In
Description

We are seeking a Principal Mechanical Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact individual contributor role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale rack deployments.

Key Responsibilities

  • Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
  • Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load extraction handles.
  • Power & Interconnects: Define mechanical paths for ultra-high-density power delivery busbars and complex cable management systems.
  • Cold Plate & Fluid Management: Own mechanical integration of liquid cooling systems, providing design feedback on cold plate layouts, manifold distribution, and QD/leak-mitigation compatibility.
  • Thermal Strategy: Support hybrid air/liquid cooling solutions for 1kW+ nodes, collaborating with thermal specialists on CFD-informed design decisions.
  • HVM Optimization: Optimize designs for high-volume manufacturing using precision milling, die casting, and complex sheet metal fabrication.
  • Environmental Ruggedization: Ensure system integrity against transportation shock and vibration and extreme thermal and humidity cycling.
  • Lifecycle Design: Implement Design for Cost (DfC) and Design for Assembly (DFA) principles to ensure seamless serviceability and global deployment readiness.
Requirements

Required Qualifications

  • B.S. or M.S. in Mechanical Engineering.
  • Design Experience: 12+ years in design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise segment.
  • Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
  • Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
  • Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of drip-free connector integration.
  • Proficiency in FEA tools for structural and vibration analysis.
  • Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.

Preferred Qualifications

  • Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
  • Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
  • Experience with blind-mate liquid and power interfaces.

Skills Required

  • B.S. or M.S. in Mechanical Engineering.
  • 12+ years design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise.
  • Proven track record of owning at least one full product lifecycle from concept through high-volume manufacturing (HVM).
  • Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
  • Technical knowledge of fluid dynamics, wetted material compatibility, and mechanical nuances of drip-free connector integration.
  • Proficiency in FEA tools for structural and vibration analysis.
  • Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.
  • Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
  • Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
  • Experience with blind-mate liquid and power interfaces.
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The Company
55 Employees
Year Founded: 2023

What We Do

Majestic Labs is reimagining AI infrastructure for the world’s most demanding workloads. Today, organizations are forced to overprovision expensive compute just to access the required memory their models need. We took a fundamentally different approach by pairing a massive amount of compute with 1000x the memory to create game changing improvements in performance, power and deployment efficiency. Our customers can literally replace racks of traditional AI infrastructure with a single Majestic server.

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