Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.
Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.
About the RoleAs a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.
ResponsibilitiesRF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).
Thermal Management: Design thermal solutions for high-power, high-density electronics.
Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.
Mechanical Design: Own mechanical design from concept through prototyping and validation.
Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.
System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.
Experience in RF electronic packaging is a must.
Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).
Strong background in mechanical design, thermal management and packaging.
Broad engineering culture with understanding of electrical and embedded systems.
MSc in Mechanical Engineering; PhD is a plus.
Rigorous, structured and mission-driven mindset with strong analytical skills.
Excellent communication and documentation abilities.
We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.
Skills Required
- Experience in RF electronic packaging
- Strong background in mechanical design, thermal management, and packaging
- Broad engineering knowledge, including electrical and embedded systems
- MSc in Mechanical Engineering
- Rigorous, structured, mission-driven mindset with strong analytical skills
- Excellent communication and documentation abilities
- Previous RF experience in radar, radio, or electronic warfare
- PhD
Harmattan AI Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Harmattan AI and has not been reviewed or approved by Harmattan AI.
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Fair & Transparent Compensation — Pay ranges are publicly shown for multiple U.S. roles (e.g., $140k–$200k base) and appear broadly in line with late‑stage startup/defense‑tech expectations based on the postings cited.
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Equity Value & Accessibility — Equity is repeatedly referenced in several job postings as part of total compensation, which can increase upside potential at a recently funded, high‑valuation company.
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Strong & Reliable Incentives — Sign‑on bonuses are explicitly mentioned in a hiring post for candidates who can start quickly, indicating the use of cash incentives in at least some hiring situations.
Harmattan AI Insights
What We Do
Harmattan AI is rising as a next-generation defense prime, building the future of autonomous warfare. We leverage AI-driven autonomy, real-time intelligence, and conflict-ready production to deliver attritable systems and autonomous mission management software. Designed for the real-world needs of warfighters, our solutions enable faster deployment, sharper decision-making, and battlefield dominance.
