The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.
The Opportunity
The Lead Engineer for Package Development is an experienced professional who takes a leading role in bringing new products from design to production. This role is responsible for defining test strategies, leading validation efforts, and driving yield improvement for complex products. Operating with a high degree of autonomy, the Lead Engineer for Package Development is a key contributor to on-time product release and profitability.
What You Will Do:
Process Set-up and Development
Process Parameter Optimization
- Optimizes process parameters by experimental designs, process variable definitions and robust design engineering for new packages or continuous improvement.
Improvement of Existing Methods and Conception of New Methods
- Conceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield, and quality.
- Spearheads generation of FMEA for new Assembly processes and reviews until completion of qualification.
Equipment Qualification and Development
- Designs and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality.
- Generates and/or reviews equipment specifications and qualification procedures and supporting documents for PAR of new equipment.
- Spearheads machine qualification and monitoring, and/or conducts equipment buy-off at supplier site. Recommends machine modifications whenever necessary.
Material Development
- Sources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability.
Product Development
- Determines machine and process capability for new products.
- Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported.
Cost Reduction and Yield Improvement
- Plans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects.
Standardization and Documentation
- Generates, interprets, and updates process and material specifications and flowcharts for new package projects.
- Interprets quality inspection criteria and specifications.
- Prepares technical reports on the results of evaluations and investigations and presents recommended actions.
Coordination/Communication of Process Issues for Improved Quality, Manufacturability and Reliability.
- Coordinates quality, manufacturability, process control and reliability issues with internal and external customers.
- Facilitates discussion of material and equipment quality and performance issues with supplier/s.
What You Will Need:
- Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering.
- Subject matter expert with at least 15 years’ experience in a Package Development, New Product Introduction and/or Sustaining role in a semiconductor assembly environment for leadframe and substrate-based packages, including failure modes and failure analysis, covering standard and custom package.
- Comprehensively perform, review and interpret mold simulations and create/recommend effective solutions to achieve optimum results.
- Review and interpret POD and tooling designs and create/recommend effective solutions to achieve design intent.
- Comprehensive knowledge of downstream and upstream Assembly processes that impact the Molding Processes) and can be impacted by the output of the Molding Process, respectively.
- Comprehensive or SME level knowledge on FA/Rel Assessment instruments namely CSAM, Cross Section, SEM and similar methods/tools.
- Comprehensive use of principles of Design for Manufacturability, DFMEA and Design Review for Manufacturability by Failure Modes (DRBFM) or its equivalent.
- Subject matter expert in the use of statistical methods of experimentation and analysis and their associated application/tools (DOE, SAS-JMP, Minitab, others) to establish and improve Process and Equipment Capability.
- Comprehensive knowledge and application of the Advance Quality Core tools (Process Flow, FMEA, Control Plan, Process Specifications and Work Instructions)
- Comprehensive knowledge and application of Problem-Solving Methods and use of the appropriate analytical techniques to establish cost effective and efficient solutions with high level of critical thinking with solution provider mindset.
- High level of effective written, oral communication, presentation, and training skills.
- High aptitude in mechanical reasoning and drawing with comprehensive knowledge of dimensioning and tolerancing.
- Comprehensive use of Continuous Improvement Tools like PDCA, Lean, others.
- Experience in handling, supervising a technical team and possesses good people skills.
Why Allegro?
Join Allegro and become part of a team where your contributions truly matter.
We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.
Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.
You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.
Join us—and help build what’s next.
Skills Required
- Bachelor’s degree in Mechanical, Electrical, Electronics and Communication, Materials, Metallurgical, Chemical, Manufacturing, or Industrial Engineering.
- At least 15 years of experience in package development, new product introduction, or sustaining roles in a semiconductor assembly environment.
- Experience with leadframe and substrate-based standard and custom packages.
- Expertise in failure modes and failure analysis.
- Ability to perform, review, and interpret mold simulations and recommend solutions.
- Ability to review and interpret POD and tooling designs and recommend solutions.
- Comprehensive knowledge of upstream and downstream assembly processes affecting molding.
- Expertise with CSAM, cross-section analysis, SEM, and similar failure analysis and reliability assessment methods.
- Knowledge and application of Design for Manufacturability, DFMEA, and DRBFM or equivalent methods.
- Expertise using statistical experimentation and analysis methods and tools, including DOE, SAS-JMP, and Minitab.
- Knowledge and application of advanced quality core tools, including process flow, FMEA, control plans, process specifications, and work instructions.
- Knowledge of structured problem-solving methods and analytical techniques.
- Strong written, oral communication, presentation, and training skills.
- Mechanical reasoning and drawing skills, including dimensioning and tolerancing.
- Experience using continuous improvement tools such as PDCA and Lean.
- Experience supervising or managing a technical team.
Allegro MicroSystems Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Allegro MicroSystems and has not been reviewed or approved by Allegro MicroSystems.
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Strong & Reliable Incentives — Feedback suggests bonuses are generous and a meaningful part of total compensation. Variable pay is viewed as reliably contributing to take-home pay.
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Healthcare Strength — Comprehensive medical, dental, vision, mental health, and fertility support is seen as robust. Day-one eligibility and advocacy services further strengthen access to care.
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Leave & Time Off Breadth — Vacation, sick/personal time, parental and family leave, holidays, and volunteer time off provide ample ways to step away from work. Generous PTO and floating holidays contribute to work-life balance.
Allegro MicroSystems Insights
What We Do
At Allegro MicroSystems, we’re passionate about developing intelligent solutions that move the world toward a safer and more sustainable future – while giving our customers a competitive edge. With more than 50 years of experience developing advanced semiconductor technology and application-specific algorithms, Allegro is a global leader in power and sensing solutions for motion control and energy-efficient systems. Through our innovations, we are helping our customers make breakthrough advancements in areas like advanced mobility, green energy, and factory automation. Each year, we ship over one billion units into these applications to support our 10,000+ customers around the globe, including over 50 automotive OEMs. Our diverse team of 3,500+ employees is spread across 13 countries, powering our global engineering, manufacturing, and support and enabling our innovations. That’s why we work hard to create a collaborative, energetic environment that rewards ingenuity and helps our employees make a difference every day.
