The Role
Lead digital circuit design for aerospace avionics under DO-254, directing board-level processor and FPGA assemblies, performing SI/PI and timing analysis, leading multi-disciplinary teams, mentoring juniors, and supporting bids, verification, and production readiness.
Summary Generated by Built In
Job Description SummaryAs a Lead Digital Design Engineer, you will be at the forefront of designing cutting-edge embedded systems for aerospace applications, adhering to DO-254 standards for New Product Introductions (NPIs) and Product Refreshes. Your expertise will shape avionics hardware architectures and support new bids and proposals.
In this dynamic role, you will mentor and collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies. This position combines leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.
You will operate within defined parameters to make critical decisions, apply innovative concepts to complex challenges, and drive solutions through immediate action or short-term planning. Join us to influence the future of aerospace technology and take your career to new heights!Job Description
In this dynamic role, you will mentor and collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies. This position combines leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.
You will operate within defined parameters to make critical decisions, apply innovative concepts to complex challenges, and drive solutions through immediate action or short-term planning. Join us to influence the future of aerospace technology and take your career to new heights!Job Description
Responsibilities
- Understand complex avionics systems, integrating both digital and analog components.
- Support activities for new bids and proposals, contributing to our growth and innovation.
- Stay ahead of technology trends and advancements in embedded systems and electronic components.
- Design processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack-up, and layout review/approval.
- Conduct board bring-up, integration, and verification activities to ensure robust performance.
- Troubleshoot complex issues involving processors, FPGAs, memory components and other components.
- Apply Design for Manufacturing (DFM), Maintainability, and Testability principles to enhance product quality.
- Participate in architectural trade studies and proposal development to drive strategic decisions.
- Interface with internal customers independently, providing expert guidance and support.
- Mentor junior engineers, fostering their growth and development.
- Lead and coordinate multi-disciplinary design teams, ensuring cohesive and effective collaboration.
- Propose and implement improvements in internal processes to drive efficiency and innovation.
Required Qualifications
- Bachelor’s degree in Electrical Engineering or related field.
- Proven experience in board-level digital design, including schematic design, implementation, integration, and verification.
- Expertise in designing high-speed interfaces.
- Proficiency in Board Level Timing Analysis, Stress and Derate Analysis,
- Signal Integrity & Power Integrity.
- Strong problem-solving skills with the ability to break down complex issues and apply critical thinking.
- Exceptional technical writing and communication skills.
- Experience mentoring and sharing expertise with junior engineers.
Desired Characteristics
- Master’s degree in Electrical Engineering with 7+ years of professional experience in digital design.
- Proven track record of understanding the architecture of complex digital hardware systems.
- In-depth knowledge of the board-level digital design process, from schematic capture to implementation, integration, and verification.
- Expertise in laying out complex Printed Wiring Boards (PWBs).
- Experience designing with high-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe.
- Proficiency in working with large pin count devices, featuring 1000+ pins with 0.8mm device pitch or smaller.
- Skilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards.
- Experience in designing high-speed serial links of 5+ Gbps, such as 10GBASE-KR, PCIe Gen3, and Fiber Optics.
- Familiarity with communication protocols like CAN, MIL-STD-1553, ARINC 429, ARINC 664, and TSN.
- Knowledge of OpenVPX and PICMG standards.
- Experience in the Military, Aerospace, or Avionics sectors.
- Proficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools.
- Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.
- Strong technical writing and communication skills.
Relocation Assistance Provided: No
Skills Required
- Bachelor's degree in Electrical Engineering or related field
- Proven experience in board-level digital design including schematic design, implementation, integration, and verification
- Expertise in designing high-speed interfaces
- Proficiency in Board Level Timing Analysis, Stress and Derate Analysis, Signal Integrity & Power Integrity
- Experience with board bring-up, integration, and verification activities
- Strong problem-solving skills and ability to decompose complex issues
- Exceptional technical writing and communication skills
- Experience mentoring and sharing expertise with junior engineers
- Master's degree in Electrical Engineering with 7+ years professional experience in digital design
- Proven track record with complex digital hardware architectures and board-level design flow (schematic to verification)
- Experience laying out complex PWBs and High Density Interconnect (micro vias, buried/blind vias, back drilling) for IPC Class 3 boards
- Experience designing with Gigahertz microprocessors, FPGA, CPLD, DDR3/DDR4, flash memory, Gigabit Ethernet, PCIe
- Experience with large pin count devices (1000+ pins, 0.8mm pitch or smaller)
- Experience designing high-speed serial links 5+ Gbps (10GBASE-KR, PCIe Gen3, Fiber Optics)
- Familiarity with communications protocols: CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN
- Knowledge of OpenVPX and PICMG standards
- Experience in Military, Aerospace, or Avionics sectors
- Proficiency with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI
- Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio
GE Aerospace Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about GE Aerospace and has not been reviewed or approved by GE Aerospace.
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Healthcare Strength — Health coverage is described as comprehensive, spanning medical, dental, vision, behavioral health support, disability, and company‑paid life/AD&D. Feedback suggests these provisions are competitive and materially enhance total rewards.
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Retirement Support — Retirement programs combine a 401(k) savings plan with company matching and an additional company retirement contribution. Feedback suggests this structure is valued for long‑term financial security.
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Parental & Family Support — Family‑oriented benefits include enhanced paid parental leave, bereavement leave for pregnancy loss, adoption assistance, and caregiver support services. Feedback suggests these policies provide meaningful support during major life events.
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