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Job Description:We are seeking a hands-on Principal Digital Design Engineer to serve as the Chip Lead for our next-generation silicon projects. In this high-impact role, you will be the primary technical anchor responsible for the top-level architecture, microarchitecture, and full chip integration. You will guide a cross-disciplinary team spanning analog design, physical design, and verification, owning the design outcome end-to-end from early product definition to a successful foundry tape-out.
Leadership & Strategic Responsibilities
Technical Ownership: Serve as the central Chip Lead, defining top-level digital architecture, partitioning hard/soft IP blocks, and owning the complete integration lifecycle.
Cross-Discipline Alignment: Act as the bridge between Logic Design, Physical Design (PD), Architecture, and Design Verification (DV) to ensure all PPA (Power, Performance, Area) targets are met.
Tape-Out Delivery: Own and drive the final tape-out sign-off checklist, coordinating across all technical teams to ensure a clean handoff to the foundry.
Mentorship & Culture: Provide technical guidance, code reviews, and architectural mentorship to mid-level and junior engineers on the team.
Technical Execution Responsibilities
RTL Design: Author, optimize, and maintain high-quality, synthesizable SystemVerilog/Verilog RTL for complex digital blocks, control logic, clocking structures, and register files (CSRs).
Timing & Constraint Ownership: Drive top-level chip timing constraints (SDC), define the Clock Domain Crossing (CDC) strategy, and establish block-level timing budgets for the PD team.
Front-End Flows: Drive logic synthesis (e.g., Design Compiler, Genus), Static Timing Analysis (STA via PrimeTime/Tempus), and run static quality checks (Lint, SpyGlass, JasperGold CDC).
IP Management: Manage the integration of custom internal analog macros, mixed-signal blocks, and third-party soft/hard IP.
Silicon Validation: Collaborate with post-silicon validation and software teams during initial chip bring-up and lab debug phases.
Required Qualifications
Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
Experience: 12+ years of direct industry experience in ASIC/SoC digital design, with a proven track record of owning chip projects or serving as a design lead.
RTL Mastery: Expert-level proficiency in SystemVerilog/Verilog digital logic design and microarchitecture principles.
Tool Fluency: Deep experience with front-end EDA tools for synthesis, STA, and CDC analysis (e.g., Synopsys or Cadence tool suites).
Silicon Track Record: Must have a proven history of successful, first-pass silicon tape-outs on modern process technologies.
Communication: Outstanding documentation and verbal communication skills; this role authors the authoritative architectural and design specifications for the entire project.
Work Authorization: Must have legal authorization to work in the US.
Preferred & Bonus Skills
Experience with mixed-signal or high-speed PHY-adjacent architectures (e.g., SerDes, PCIe, DDR, or custom interconnects).
Familiarity with DFT (Design for Test) planning, including scan insertion, ATPG planning, and boundary scan.
Proficiency in scripting (Python, Tcl, Perl) to automate and streamline front-end design flows.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $143,800 - $230,000.
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.
- 12+ years industry experience in ASIC/SoC digital design with proven track record owning chip projects or serving as design lead.
- Expert-level proficiency in SystemVerilog and Verilog for synthesizable RTL design.
- Deep experience with front-end EDA tools for synthesis, STA, and CDC analysis (Synopsys or Cadence tool suites; e.g., Design Compiler, Genus, PrimeTime, Tempus).
- Experience running static quality checks and CDC analysis (Lint, SpyGlass, JasperGold CDC).
- Ownership of top-level timing constraints and CDC strategy (SDC, clock domain crossing planning).
- Proven history of successful first-pass silicon tape-outs on modern process technologies.
- Outstanding documentation and verbal communication skills; ability to author architectural and design specifications.
- Must have legal authorization to work in the US.
- Experience with mixed-signal or high-speed PHY-adjacent architectures (SerDes, PCIe, DDR)
- Familiarity with DFT planning including scan insertion, ATPG planning, and boundary scan.
- Proficiency in scripting to automate front-end flows (Python, Tcl, Perl).
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.








