Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible.
We currently have internship openings in our Engineering Team for MSc students in Dortmund - North Rhine-Westphalia - Germany and the surrounding area, offering a 6-month term with the possibility of extension, in the following areas:
Your Responsibilities
Depending on your area of expertise, you will support one or more of our engineering teams in the following areas:
Digital Design
Support the RTL design of digital circuits using SystemVerilog or VHDL.
Contribute to the development, analysis, and optimization of digital logic.
Support synthesis flows and evaluate synthesis results.
Digital Verification
Develop and maintain verification environments using SystemVerilog and UVM.
Create and execute functional tests.
Support the implementation of SystemVerilog Assertions.
Physical Design
Support floorplanning, place-and-route, and design implementation activities.
Contribute to Static Timing Analysis tasks.
Develop automation and data-analysis scripts.
Analog Design
Support the development and analysis of analog and mixed-signal circuits.
Contribute to SPICE-based circuit simulations.
Support high-speed SerDes, PLL, or related connectivity design activities.
Your Qualifications
Currently enrolled in a Master's degree program in Dortmund- North Rhine-Westphalia-Germany and the surrounding area in Electrical Engineering, Microelectronics, Telecommunications Engineering, Information Technology, Computer Engineering, or a related field, with a completed Bachelor's degree.
Basic knowledge in at least one of: digital design & RTL, digital verification, physical design, or analog/mixed-signal design.
Structured, analytical, and detail-oriented working style with clear documentation skills.
Preferred Additional Skills
Depending on your area of assignment, the following are a plus:
Digital: SystemVerilog, VHDL, UVM, SystemVerilog Assertions, or formal verification.
Physical Design: Static Timing Analysis, CDC analysis, floorplanning/place-and-route, Cadence Innovus or Synopsys ICC2.
Analog: SPICE simulation, Cadence Virtuoso, high-speed SerDes or PLL design.
General: Python, Tcl, or Perl scripting; version-control systems and automated development flows.
What We Offer
Hands-on exposure to real semiconductor and connectivity projects, working closely with experienced engineering teams.
The chance to apply your Master's coursework to real-world engineering tasks in an international environment.
Flexible working hours with meaningful, independent responsibilities and hybrid options where applicable.
Application
Please submit your CV and include the following information:
Your Master's degree program, university, and expected graduation date.
Proof of current enrollment.
Preferred technical area of assignment and availability (hours per week).
Relevant experience (projects, internships, EDA tools/languages) and earliest possible start date.
Skills Required
- Currently enrolled in a Master's degree program in Electrical Engineering, Microelectronics, Telecommunications Engineering, Information Technology, Computer Engineering, or a related field
- Completed Bachelor's degree
- Enrollment in or near Dortmund, North Rhine-Westphalia, Germany
- Basic knowledge of digital design and RTL, digital verification, physical design, or analog/mixed-signal design
- Structured, analytical, and detail-oriented working style
- Clear documentation skills
- SystemVerilog, VHDL, UVM, SystemVerilog Assertions, or formal verification
- Static Timing Analysis, CDC analysis, floorplanning/place-and-route, Cadence Innovus, or Synopsys ICC2
- SPICE simulation, Cadence Virtuoso, high-speed SerDes, or PLL design
- Python, Tcl, or Perl scripting
- Version-control systems and automated development flows
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
