Internship - AI Engineer

Posted Yesterday
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Saint-Sulpice, QC, CAN
In-Office
Internship
Artificial Intelligence • Hardware • Semiconductor
The Role
Build and deploy domain-specific AI and agentic tools for semiconductor engineering workflows. Responsibilities include designing reliable agentic systems, integrating LLM tools into analog, digital, and verification environments, creating evaluation pipelines, collaborating with engineering teams, and delivering modular, tested, maintainable code.
Summary Generated by Built In

Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible.

 

Today we have one internship position available for max 6 months, in our applied AI engineering Team, for MSc students in the following area :

 

About the role:

Kandou pushes the boundaries of state-of-the-art semiconductor and electronic design, an arena where off-the-shelf AI tools often fall short. As an AI Engineering Intern, you’ll join our AI team to build custom, cutting-edge AI tools that transform how our engineers work. You will operate at the intersection of AI and hardware, developing high-impact solutions for our Analog, Digital, and Verification design teams.

The goal of this internship is to bridge state-of-the-art AI techniques with complex semiconductor engineering workflows. You will design, evaluate, and deploy domain-specific AI tools that automate, accelerate and innovate in design iterations across Kandou’s Analog, Digital, and Verification teams.

 

Responsibilities:

  • Architect & build agentic systems: Go beyond basic multi-agent setups to design robust, reliable agentic workflows that extract knowledge, execute complex reasoning, and generate design artifacts. Ensure these systems strictly enforce Kandou's design rules and best practices synthesized from past engineering projects and historical codebases.

  • Partner across engineering teams: Work closely with engineers to identify engineering bottlenecks, gather their feedback, and integrate into their workflows.

  • Integrate into engineering pipelines: Seamlessly embed agentic tools directly into engineers' environments.

  • Evaluate & iterate: Design evaluation pipelines and refine systems based on the evaluations and developer feedback.

  • Deliver high-quality code: deliver modular, well-tested, and maintainable software

Qualifications:

  • Strong background in AI and LLM

  • Proficiency in software programming, and delivering high quality code using AI coding agents

  • Experience with LLM systems including tool-calling, agents, skills, structured output generation, and MCP

  • Strong communication and presentation skills

  • Ability to research independently

  • Problem solving skills

  • Basic understanding of semiconductor/electronic design concepts or hardware description languages is a strong plus, but not strictly required

Benefits:

  • Gain hands-on experience in an industrial research lab,

  • Shadowing knowledgeable professionals,

  • Opportunity to see the inner workings of a startup,

  • Compensation available.

  • Access to very advanced process nodes

 

If you recognize yourself in the description above, and love to be part of a growing Company, are a good team player with an upbeat approach to life, we would love to hear from you. Together We Kandou It!

Skills Required

  • MSc student in a relevant area
  • Strong background in artificial intelligence and large language models
  • Proficiency in software programming and delivering high-quality code using AI coding agents
  • Experience with LLM systems, including tool calling, agents, skills, structured output generation, and MCP
  • Strong communication and presentation skills
  • Ability to research independently
  • Problem-solving skills
  • Basic understanding of semiconductor or electronic design concepts or hardware description languages
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The Company
222 Employees

What We Do

Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.

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