HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology.
At the core of our work is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.
We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another.
Our growing team is looking for an Integrated Photonics Design Engineer at Senior or Staff levelto lead process design kit (PDK) development for HyperLight’s co-packaged optics product line.This hands-on role, based at HyperLight's headquarters, collaborates very closely with our internal component design, process engineering, and test teams to drive PDK development and ensure fast time-to-market. In this role you will be involved in all product-related discussions and decisions that have direct impact on HyperLight's business. As part of your responsibilities, you will:
- Collaborate with our product team, foundries, and customers to define device component and fabrication process performance requirements for co-packaged optics applications
- Lead the end-to-end design and validation of high performance device components, in collaboration with other component designers and process engineers
- Own and maintain the process design kit (PDK) for our co-packaged optics platform
- Contribute to the development of design, layout and verification enablement toolsets in open source and commercial tools including GDSFactory, Cadence Virtuoso, Synopsys Optocompiler and ICV, and Siemens Calibre.
Requirements
- Either 5+ years of relevant work experience or equivalent experience through an advanced degree (M.S. or Ph.D.) in Electrical Engineering, Physics, or a related field.
- Strong expertise with passive and/or active photonic device component design, including hands-on development of multiple successful designs.
- Strong expertise in finite element analysis of PIC components using tools like Lumerical, Tidy3D, COMSOL, Synopsys OptoDesigner, etc.
- Extensive hands-on experience performing measurements to characterize photonic integrated circuits using instruments like swept lasers, fiber alignment stages, VNAs, BERTs, oscilloscopes, etc.
- Extensive experience with data analysis and statistical methods such as design of experiments using tools like JMP or Python.
- Demonstrated record of innovation and achievement, e.g. product designs, publications, or patents.
- Familiarity with the entire PIC engineering process, including simulation, layout, fabrication, test, and device operation.
- Excellent organizational and communication skills
- Comfortable working with cross-disciplinary teams
Benefits
- Competitive market-based compensation (Salary range $150,000 - $225,000)
- Comprehensive health coverage, including medical, vision, and dental plans for individuals and families
- 401(k) retirement plans with employee matching
- Paid Parental Leave
- Life and disability insurance
- Commuter benefits and subsidies
- Professional growth and mentorship opportunities
This role is in-person at HyperLight's office in Cambridge, MA. Authorization to work in the US is required.
HyperLight is an equal opportunity employer. All applicants will be considered for employment without attention to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. HyperLight is committed to providing reasonable accommodations to individuals with disabilities during our hiring process. If you need assistance or an accommodation, please contact us at [email protected].
Skills Required
- 5+ years of relevant work experience or equivalent experience through an advanced degree (M.S. or Ph.D.) in Electrical Engineering, Physics, or a related field
- Strong expertise with passive and/or active photonic device component design
- Strong expertise in finite element analysis of PIC components using tools like Lumerical, Tidy3D, COMSOL
- Extensive hands-on experience performing measurements to characterize photonic integrated circuits
- Extensive experience with data analysis and statistical methods such as design of experiments
- Familiarity with the entire PIC engineering process
- Excellent organizational and communication skills
- Comfortable working with cross-disciplinary teams
What We Do
The information age relies on billions of devices converting signals between electricity and light waves. These integrated light circuits are the backbone of telecommunication infrastructures, data centers, sensors, and even secure quantum communications. Our devices set new benchmarks for performance, including extraordinary speed and efficiency, that will force industries to rethink and reimagine their current standards.
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