Integrated Circuit (IC) Package Design and Layout Engineer

Posted 3 Days Ago
Be an Early Applicant
Kissimmee, FL, USA
In-Office
Mid level
Artificial Intelligence • HR Tech • Professional Services • Analytics
The Role
Design and develop advanced IC package layouts using FOWLP, interposer, flip-chip, and 2.5D/3D packaging technologies. Responsibilities include customer support, PDK distribution and management, design-rule verification, design-rule and methodology development, package drawing preparation, mask acquisition coordination, and customer training. The role collaborates with internal teams, customers, and vendors to optimize manufacturability, cost, performance, and reliability.
Summary Generated by Built In

Type:

  • Direct Hire

Full Time or Part Time:

  • Full-Time

Pay Rate:

  • TBD

Location:

  • Kissimmee, FL 34744

Language Requirements:

  • Write, read, and speak English fluently.

Language Preferences:

  • N/A

Job Overview:

We are looking for an Integrated Circuit (IC) Package Design and Layout Engineer for our Florida Advanced Packaging site. The ideal candidate will have demonstrated experience in the design of advanced packages based on wafer level technologies. You will work closely with external customer design teams and our own internal engineering team to develop and optimize designs for lowest cost, highest manufacturability, performance, and reliability. You will support our Florida initiatives in advanced assembly processes for multiple application areas, including Fan-Out Wafer Level Packaging (FOWLP), interposers and other technology platforms.

Your tasks will include: Design and layout of advanced 2.5D/3D packages based on FOWLP, interposer, and other advanced heterogeneous integration technologies; Work directly with customers to support PDK distribution, package layout, and design rule check/verification; Create and maintain design rules and design methodologies; Development and preparation of detailed drawings for customers, such as package outline drawings, and detailed drawings for IC packaging designs; Work with vendors to accept, manage, and modify PDKs (as needed) for our standard platform offerings; Train customers on use of PDKs for their own designs and provide customer support; Coordinate mask acquisition for fab photolithography tools as needed; The job also requires performing other duties as assigned; Percentages of time spent on job duties are estimates and may vary for each position.

Experience Requirements:

  • Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent. A commensurate combination of degree and experience will be considered.

  • 3+ years of experience in physical design and IC package Layout related to WLCSP, FOWLP and/or flip chip packaging technologies (other relevant IC package, PCB, or IC layout/design experience may also be considered).

  • Proficient in geometric dimensioning and tolerancing.

  • Knowledge of wafer level package assembly and manufacturing processes.

  • Signal Integrity knowledge and experience is an added advantage.

  • Proficient in Cadence APD, AutoCAD, Siemens Calibre or similar/equivalent EDA systems and the management of PDKs.

  • Can work both independently and in cross-functional teams for problem solving.

  • Excellent oral and written communication skills in English and Microsoft Office applications (Excel, Word, PowerPoint) are required to communicate ideas effectively and efficiently with customers, colleagues, and management.

  • US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

Experience Preferences:

  • N/A

Physical Requirements:

  • Ability to lift light equipment or materials, generally up to 20-30 pounds.

  • Adequate vision to perform tasks effectively, including close and distance work.

  • Good hearing ability to effectively communicate and respond to auditory cues.

  • Capacity to perform repetitive tasks consistently with minimal breaks, demonstrating endurance and stamina throughout the work shift.

  • You will be based in Kissimmee, Florida but open to travel abroad for technical discussions, training and brainstorming.

Education Requirements:

  • BS Engineering, Physics, Electrical Engineering, Materials Science or equivalent.

Education Preferences:

  • MS/PhD preferred.

Training Schedule:

  • TBD

Schedule:

  • TBD

Dress Code:

  • Business Casual

Benefits:

  • TBD

Additional Information:

Drug screening, background and reference checks are performed if required. Valid identification and reliable transportation required. We are an E-Verify employer. We will provide the Social Security Administration (SSA) and, if necessary, the Department of Homeland Security (DHS), with information from each new employee’s Form I-9 to confirm work authorization. Our employees are authorized to work in the United States.

Skills Required

  • Bachelor's degree in Engineering, Physics, Electrical Engineering, Materials Science, or equivalent experience
  • 3+ years of physical design and IC package layout experience involving WLCSP, FOWLP, flip-chip, PCB, or IC layout/design
  • Proficiency in geometric dimensioning and tolerancing
  • Knowledge of wafer-level package assembly and manufacturing processes
  • Proficiency with Cadence APD, AutoCAD, Siemens Calibre, or equivalent EDA systems
  • Experience managing process design kits (PDKs)
  • Ability to work independently and in cross-functional teams
  • Excellent oral and written English communication skills
  • Proficiency with Microsoft Office applications, including Excel, Word, and PowerPoint
  • U.S. citizenship and ability to hold or obtain a government security clearance
  • Master's degree or PhD
  • Signal integrity knowledge and experience
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The Company
6 Employees
Year Founded: 2018

What We Do

Qwalifize is an Operational Intelligence company that combines technology-enabled staffing, consulting, data visibility, and intelligent asset tracking. It helps commercial organizations and government agencies improve operational visibility, efficiency, safety, compliance, and performance by monitoring people, tools, supplies, and equipment in real time. Its technology offerings include AIoT, RFID, embedded technology, AI, CCTV, and proprietary learning-management solutions across construction, healthcare, manufacturing, warehouse, and multi-location environments.

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