Broadcom

III-V Wafer Fab Process Engineer (Lithography)

Posted 3 Days Ago

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Singapore, SGP

In-Office

Expert/Leader

Software • Semiconductor • Manufacturing

The Role

Develop, qualify, and sustain photolithography and etch processes for III-V wafer fabrication. Establish process windows, qualify materials and equipment, perform DOE and statistical analysis, support manufacturing and yield improvement, troubleshoot process excursions, and maintain process control documentation (WI, PFMEA, OCAP, recipes, ECO).

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Job Description:

Position Summary

The III-V Wafer Fab Process Engineer is responsible for developing, qualifying, and sustaining photolithography and etch processes used in the manufacture of III-V compound semiconductor devices, including InP and GaAs based technologies. The engineer will establish robust manufacturing processes for R&D, new product, optimize yield and process capability, support high-volume manufacturing, and collaborate with cross-functional teams to deliver reliable and cost-effective manufacturing solutions.

Key Responsibilities

Develop and optimize photolithography processes for III-V wafer fabrication.

Establish process windows for critical lithography parameters, including:

Photoresist coating, bake and develop
Exposure dose and focus
Overlay accuracy
Critical dimension (CD) control
Pattern fidelity and defectivity
Qualify new photoresists, developers, bottom anti-reflective coatings (BARC), and lithography materials.
Develop processes for broadband, i-line, DUV (193 nm), aligner/stepper/scanner platforms.
Optimize lift-off lithography processes for metal patterning.
Minimize defects such as particles, bridging, resist lifting, and pattern collapse.
Mask Layout and reticle design / tape out

Process Qualification

Develop qualification plans for new lithography and etch equipment.
Define process acceptance criteria and process capability targets.
Conduct Design of Experiments (DOE) to optimize process windows.
Perform process characterization and statistical analysis.

Manufacturing Support

Monitor process health using SPC.
Investigate process excursions and implement corrective and preventive actions.
Troubleshoot lithography and etch-related issues affecting yield or productivity.
Support engineering lots, pilot production, and high-volume manufacturing.

Yield Improvement

Analyze yield loss associated with lithography and etch processes.
Perform root cause analysis using 8D, 5 Why, Fishbone, and FMEA methodologies.
Drive continuous improvement projects to reduce defects and improve process capability.

Process Control & Documentation

Develop and maintain: WI, Control Plans, PFMEA, OCAP, Process Recipes, ECO

Qualifications

Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics.
10+ years of semiconductor wafer fabrication experience.
Minimum 10 years of direct experience in lithography and/or plasma etch processes.
Experience with III-V semiconductor manufacturing is highly preferred.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Skills Required

Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics.
10+ years of semiconductor wafer fabrication experience.
Minimum 10 years of direct experience in lithography and/or plasma etch processes.
Experience with Design of Experiments (DOE), statistical process control (SPC), and process characterization/statistical analysis.
Experience with root cause analysis and continuous improvement methods (8D, 5 Why, Fishbone, FMEA).
Experience with III-V semiconductor manufacturing (InP/GaAs).

Broadcom Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.

Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.