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Job Description:
Job Description : ( IC Design Engineer4)
Block Level and Full chip level Static(IR)/Dynamic(IVD) sign-off
Signal/Power EM sign-off at Block level and Full chip
Custom power grid implementation for block/hardmacs
System level Analysis (PDN) with board, package, interposer and die
Work with SoC and packaging team in bump assignment, pkg routing optimization
Dynamic analysis with vectorless/vectors/mixed mode analysis
PG Grid resistance checks
Knowledge of physical implementation is a plus
Skill Set :
Hands-ons experience in RedHawk/RHSC/Voltus/PDN analysis/3DIC
Good understanding on Power Integrity Signoff Checks
Knowledge of Perl, TCL, Python
Familiarity with Innovus/ICC
Ability to communicate effectively with global cross functional teams
Education
Minimum Qualifications
Bachelors – CS/EE/EC
Work Experiences
Minimum years of experience : 1 to 9 Yrs
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Top Skills
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs,
develops and supplies semiconductor and infrastructure software solutions.
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