IC Design Engineer

Posted Yesterday
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Hiring Remotely in Electronics City, Bangalore, Karnataka, IND
Remote
Mid level
Software • Semiconductor • Manufacturing
The Role
Perform block- and full-chip static (IR) and dynamic (IVD) sign-off; power estimation (vector and vectorless); signal and power EM sign-off; implement custom power grids; conduct system-level PDN analysis across board, package, interposer, and die; collaborate with SoC and packaging teams on bump assignment and package routing optimization; run vectorless, vector, and mixed-mode dynamic analyses and PG grid resistance checks.
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Job Description:

Block Level and Full chip level Static(IR)/Dynamic(IVD) sign-off

Power Estimation on blocks and full chip (both vector and vectorless)

Signal/Power EM sign-off at Block level and Full chip

Custom power grid implementation for block/hardmacs
System level Analysis (PDN) with board, package, interposer and die

Work with SoC and packaging team in bump assignment, pkg routing optimization
Dynamic analysis with vectorless/vectors/mixed mode analysis

PG Grid resistance checks

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Skills Required

  • Block-level and full-chip static (IR) and dynamic (IVD) sign-off
  • Power estimation on blocks and full chip (vector and vectorless)
  • Signal and power EM sign-off at block level and full chip
  • Custom power grid implementation for blocks and hard MACs
  • System-level PDN analysis including board, package, interposer, and die
  • Collaborate with SoC and packaging teams on bump assignment and package routing optimization
  • Dynamic analysis with vectorless, vectors, and mixed-mode analysis
  • PG grid resistance checks

Broadcom Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.

  • Equity Value & Accessibility Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
  • Retirement Support A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
  • Pay Growth & Progression Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.

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The Company
HQ: Palo Alto, CA
38,985 Employees
Year Founded: 1991

What We Do

Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.

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