Hardware Engineer

G5 Infrared a LightPath Technologies company is a leading global provider of precision optics and photonics solutions, serving defense, aerospace, medical, and industrial markets. With decades of expertise and a strong culture of innovation, LightPath designs and manufactures advanced optical components and systems that power some of the world’s most demanding applications. We offer a collaborative, technology-driven environment, opportunities to work on cutting-edge programs, and a comprehensive benefits package that supports our employees’ health, growth, and work-life balance.

We are currently looking for a Hardware Engineer to join our team onsite in our Hudson, NH office. We offer a professional, high-energy culture where employees are empowered to succeed.

This position will support the design, development, and manufacturing introduction of new thermal imaging camera products. The successful candidate will contribute to all phases of the hardware development lifecycle—from initial circuit design through prototype bring-up and transition to production. This role offers significant hands-on experience with modern EDA tools, lab debug of sophisticated cooled-detector camera electronics, and direct collaboration with engineering, manufacturing, and external vendors. It is an excellent opportunity for an early-career engineer to grow technical breadth while delivering real products to customers in security, defense, and critical-infrastructure markets.

Responsibilities:

• Perform circuit design and analysis for analog, digital, mixed-signal, and power circuits used in thermal imaging camera products.
• Capture schematics and execute PCB layout using Altium Designer, working from initial component selection through DRC-clean, manufacturable boards.
• Create and maintain Bills of Materials (BOMs) and engineering documentation; manage BOM data and engineering change orders in the company ERP system.
• Work closely with the manufacturing team to introduce new products to production, including DFM/DFT reviews, pilot builds, yield improvement, and resolution of production-floor issues.
• Coordinate with external vendors for PCB fabrication and assembly of engineering prototypes; manage quotes, fab/assembly data packages, and quality issues.
• Perform SMT and through-hole soldering, rework, and modification of prototype assemblies.
• Conduct lab bring-up, debug, and characterization of prototype camera hardware using oscilloscopes, logic analyzers, spectrum analyzers, multimeters, power supplies, and other lab instrumentation.
• Support integration and test of cooled MWIR detector electronics, motorized zoom lens control, video output (HD-SDI / IP), and serial command interfaces (RS-232/422).
• Author and maintain test procedures, design verification reports, and product documentation.
• Support sustaining engineering activities for products in production, including component obsolescence and design refresh efforts.
• Collaborate effectively with cross-functional teams including senior electrical, optical, mechanical, software, manufacturing, and quality engineering.

Required

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a closely related discipline.
• 5-7 years of relevant industry, internship, co-op, or substantive project experience in electronic hardware design.
• Working knowledge of analog and digital circuit fundamentals, including familiarity with common interfaces (I2C, SPI, UART, USB, Ethernet) and power supply design basics.
• Hands-on proficiency with Altium Designer for schematic capture and PCB layout or demonstrated ability to ramp quickly from experience with comparable tools (KiCad, OrCAD, Mentor).
• Practical SMT and through-hole soldering skills; comfort with rework of fine-pitch components and prototype-level board modification.
• Demonstrated competence with standard lab test equipment: oscilloscopes, logic analyzers, DMMs, bench power supplies, function generators.
• Strong written and verbal communication skills; ability to document work clearly and collaborate across engineering and manufacturing teams.
• Self-motivated, detail-oriented, and able to manage multiple concurrent tasks in a small-team environment.
• Ability to obtain U.S. export-controlled information access (ITAR/EAR) as required for the role.

Preferred

• Experience with Visual ERP or a comparable ERP/MRP system for BOM management, part creation, and engineering change control.
• Familiarity with FPGA design concepts and tools (Xilinx Vivado, Intel Quartus, or similar); exposure to HDL (VHDL or SystemVerilog) is a plus.
• Scripting and programming skills (Python, C, MATLAB, Bash, or PowerShell) for test automation, data analysis, lab instrument control, and embedded debug is also a plus.
• Exposure to imaging systems, cameras, video interfaces (HD-SDI, MIPI CSI-2, Camera Link, GigE Vision), or infrared / electro-optical sensor systems.
• Experience with high-speed digital design, signal integrity considerations, controlled-impedance routing, or high-speed serial interfaces.
• Exposure to embedded firmware, microcontroller bring-up, or board support package debug.
• Familiarity with IPC standards (IPC-A-610, J-STD-001) and design-for-manufacturing best practices.
• Experience taking a product from prototype through to volume production, particularly for ruggedized or environmentally qualified hardware.

Knowledge, Abilities and Skills:

• Ability to use soldering equipment and benchtop test instrumentation
• Perform close-up visual inspection of small components
• Lift equipment up to 25 lbs
• Periodic travel to vendors and partner sites may be required.