At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
Job Title: Hardware Design Engineer - Board Product
Location: Taipei, Taiwan
Responsibility
Will be a hardware board designer of server motherboard systems that utilize novel Kandou signalling technology.
Will coordinate and drive the work of internal contributors and of external vendors.
Will define, develop and validate board hardware systems based on requirement.
On-site support board builds and early lab bringup and be engaged in cradle-to-grave development of system hardware products.
Support preliminary system assembly; business trip might require.
Prepare and communicate technical analyses and recommendations to internal teams and some customers.
Board schematic capture & review of the work of other engineers. PCB layout review and providing feedback.
Review SI/PI and thermal/mechanical analysis of boards and systems.
Required Experience
10+ years of experience in the computer server development industry, with a focus on leading mainstream server motherboard designs into volume production.
Desired experience of working with custom silicon based server systems.
Proven experience of 8+ years providing timely inputs to adjacent functions such as PCB CAD, power VRM design, SI/PI analysis, firmware engineering and thermal/mechanical into design trade offs and alignment.
Proven experience of 8+ years and demonstrated connections into key vendors in PCB fab, connectors & passives, key ICs and VRMs.
Proven experience of board builds and lab bring ups especially including guiding the relevant engineering teams.
Required Skills
Ability to learn new server technologies quickly.
Lab board bring up experience across power on and integration and testing of early firmware.
Exposure to lab tools such as logic analyzers & oscilloscopes and some special characterization and testing frameworks such as Cscripts and low level Linux/Windows utilities.
System validation procedures including driving compliance testing of motherboard/systems for PCIe and environmental testing
Required Education
Required: 4 year Bachelor of Engineering in Electronics, Computer or Electrical Engineering or equivalent study.
Desired: Advanced academic or other training such as Masters in Engineering.
www.kandou.ai.
Skills Required
- 10+ years of experience in computer server development, focused on leading mainstream server motherboard designs into volume production
- Experience working with custom silicon-based server systems
- 8+ years providing inputs to PCB CAD, power VRM design, SI/PI analysis, firmware engineering, and thermal/mechanical functions
- 8+ years of experience and established vendor connections in PCB fabrication, connectors and passives, key ICs, and VRMs
- Experience with board builds and laboratory bring-up, including guiding engineering teams
- Ability to learn new server technologies quickly
- Laboratory board bring-up experience covering power-on, integration, and early firmware testing
- Experience with logic analyzers, oscilloscopes, characterization frameworks, and low-level Linux or Windows utilities
- Experience with system validation and PCIe and environmental compliance testing
- Four-year Bachelor of Engineering degree in Electronics, Computer, or Electrical Engineering, or equivalent study
- Master's degree in Engineering or advanced academic or technical training
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
