Basic understanding of IC design, package/platform architectures, signal and/or power integrity knowledge.
Exposure to package, board layout or 3D modeling tools, and electrical validation is highly value-added.
Good communication skills and team player.
BSEE with relevant or adjacent education syllabus focus.
Job Type:Intel Contract EmployeeShift:Shift 1 (Malaysia)Primary Location: Malaysia, PenangAdditional Locations:Malaysia, KulimBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Basic understanding of IC design, package/platform architectures, signal and/or power integrity knowledge.
- Exposure to package, board layout or 3D modeling tools, and electrical validation is highly value-added.
- Good communication skills and team player.
- BSEE with relevant or adjacent education syllabus focus.
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
-
Parental & Family Support — Family-building and caregiving supports are extensive, including fertility coverage, adoption assistance, paid parental leave, childcare and elder care resources, and a structured reintegration for new parents. These benefits are positioned as best-in-class elements of the package.
-
Leave & Time Off Breadth — Time off includes generous PTO, a paid sabbatical after extended tenure, and multiple leave types such as family, medical, bereavement, and military. This breadth enables employees to disconnect, recharge, and manage life events.
-
Retirement Support — Long-term savings are bolstered by a competitive 401(k) match and access to deferred compensation for eligible levels, alongside stock purchase opportunities. These programs are highlighted as strong tools for financial security.
Intel Insights
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
