Intel is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and artificial intelligence. Intel Foundry is Intel's externally facing foundry business, committed to delivering world-class semiconductor manufacturing solutions to a broad and growing customer base. With cutting-edge facilities across the United States and globally, Intel Foundry is uniquely positioned to serve the next generation of chip design companies and technology leaders.
The Manufacturing Development and Customer Engineering (MDCE) organization serves as the critical bridge between advanced technology development and scalable, high-volume manufacturing. MDCE ensures that innovative semiconductor solutions can be successfully produced and delivered to foundry customers — reliably, efficiently, and at scale.
We are seeking a highly skilled and experienced CMOS Device Technologist to join the MDCE Device team. In this role, you will be at the forefront of developing and customizing semiconductor technologies for high-volume manufacturing, with a focus on general-purpose logic CMOS technologies. Your work will support a broad spectrum of products and markets, including high-performance compute, mobile, mixed signal, memory controllers, and other diverse applications.
This is a rare and exciting opportunity to directly contribute to the advancement of Intel Foundry's semiconductor solutions, working alongside world-class engineers to push the boundaries of device performance, power efficiency, and technology scaling. Whether you are based in Hillsboro, Oregon, Chandler, Arizona, or Santa Clara, California, you will be part of a globally connected, mission-driven team.
Key Responsibilities:
Collaborate with the Technology Development team to develop new device technologies and customize newly developed device architectures to meet specific foundry customer needs
Partner with manufacturing teams to develop and refine fabrication processes that meet device specifications and yield targets
Develop CMOS logic device technologies supporting high-performance compute, mobile, mixed signal, memory controllers, and broad market applications
Drive the development and implementation of customized semiconductor device technologies, ensuring compatibility with Intel's existing manufacturing processes and platforms
Leverage data analysis, scripting, and analytical techniques to accelerate learning cycles and resolve process and manufacturing challenges
Contribute to design of experiments (DOE) and engineering data analysis to identify and address yield and performance challenges
As a Successful Candidate, You Will Bring:
Exceptional communication skills — to convey complex technical concepts clearly and effectively to diverse audiences
Collaborative mindset — proven skills to work within globally diverse, cross-disciplinary teams
Intellectual curiosity — a genuine desire to continuously learn and grow within a rapidly evolving field
Leadership and influence — capacity to lead and influence cross-functional teams without direct authority
Adaptability and resilience — skills to thrive and deliver results in a fast-paced, ambiguous environment
Problem-solving orientation — a structured, analytical approach to tackling complex technical and organizational challenges
If you are passionate about pushing the boundaries of semiconductor technology and want to make a meaningful impact at one of the world's most innovative companies, we want to hear from you.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Master’s degree in electrical engineering, physics, or related field of study with 5+ years of experience in CMOS device engineering. The years of experience must include:
• CMOS device technology, preferably in a foundry environment
• CMOS device physics and fabrication of advanced transistor device architectures
• Data analysis, scripting, and data analytic techniques to accelerate learning
Preferred Qualifications:
• Ph.D. Degree in Electrical Engineering, Physics, or related field of study
• 7+ years of experience in:
CMOS device engineering
Advanced node semiconductor technology device development
Generation and analysis of device parametric data, design of experiment (DOE) principles, and engineering data analysis tools
Device data analysis for identifying and resolving process and manufacturing challenges
Track record of delivering results in a fast-paced environment
Working in advanced FinFETs / GAA FETs
High-Volume Manufacturing environment
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, Arizona, Phoenix, US, California, Santa ClaraPosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $161,550.00-317,600.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Master's degree in electrical engineering, physics, or a related field
- 5+ years of experience in CMOS device engineering
- Experience with CMOS device technology, preferably in a foundry environment
- Experience with CMOS device physics and fabrication of advanced transistor device architectures
- Experience with data analysis, scripting, and data analytics techniques
- Ph.D. degree in electrical engineering, physics, or a related field
- 7+ years of experience in CMOS device engineering
- Experience with advanced-node semiconductor technology device development
- Experience generating and analyzing device parametric data
- Knowledge of design-of-experiments principles and engineering data analysis tools
- Experience analyzing device data to identify and resolve process and manufacturing challenges
- Track record of delivering results in a fast-paced environment
- Experience working with advanced FinFETs or GAA FETs
- Experience in a high-volume manufacturing environment
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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