Failure analysis and TEM Engineer

Job Details:

Job Description: 

Intel created HVM Global labs organization to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with the Technology Development (TD) team, and FSM fab managers.
This job requisition is seeking a Transmission Electron Microscopy (TEM) Engineer working in our Israeli failure analysis laboratories. Selected candidate will work in a dynamic team supporting technology development and yield improvement. The TEM group uses the latest state-of-the-art workflows leveraging a high level of autonomy. TEM engineers may support conventional manual TEM.
TEM Engineers Responsibilities Include (but Are Not Limited To)
• Review incoming requests and determine appropriate TEM workflow strategy. Prepare plans as appropriate for TEM sample preparation team.
• Hands on operation of laboratory equipment, such as TEM microscopes.
• Interpretation of complex TEM results, translating to actionable data for FAB process and integration teams.
• Support continual improvement and development of new workstreams and techniques.
• Develop a thorough understanding of manual TEM operation lines.
• Mentor TEM preparation technicians.
• Candidate should have the following behavioral skills:
• Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills.
• Inquisitive, desire to learn and expand knowledge in field.
• Ability to work with multi-functional, multi-cultural teams.
• Strong in decision making and problem solving.

This position requires to work weekends based on business needs.

Qualifications:

What We Are Looking for:
• Master's/PhD degree in science and engineering.
• 2 years experience in a TEM engineering laboratory or semiconductor, (including student experience).

Preferred Qualifications
• Ph.D. in science and engineering major.
• Greater than 5 years' experience operating a Transmission Electron Microscope and material characterization techniques.
• Experience with various types of TEM sample preparation.
• Strong TEM interpretation skillset
• Understanding of FinFET technology architecture.
• Knowledge of wafer fabrication and general microelectronics.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:Experienced Hire

Shift:Shift 1 (Israel)

Primary Location: Israel, Kiryat-Gat

Additional Locations:

Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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