The Role
Leads external semiconductor manufacturing NPI from product conceptualization through qualification, launch, production ramp, and transition to high-volume manufacturing. Drives assembly readiness with OSAT partners, including process flow and BOM setup, risk mitigation, characterization, qualification, audits, yield improvement, and production safe launch. Coordinates cross-functional internal and external stakeholders, establishes manufacturing best practices, supports package technology roadmaps, and serves as a subject matter expert for package and assembly challenges.
Summary Generated by Built In
External Manufacturing NPI Engineer
Responsibilities- Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
- Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
- Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
- Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
- Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
- Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
- Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
- Adoption of data analytics and data-driven approach to problem solving and decision making
- Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
- Participate in quality and process readiness audit to achieve production site readiness
- Co-work with operations to drive continuous yield improvement for evolving challenges
- Subject Matter Expert to address arising package and assembly challenges
- Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
- Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
- Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
- Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
- Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
- Good overall understanding of OSAT business landscape and operations
- Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
- Strong project management skills and multi-stakeholder management
- Proficient in statistical analysis methods and familiar with data analytics
- Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Skills Required
- Bachelor’s degree in Engineering, Materials Science, or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing
- In-depth semiconductor assembly process expertise and shop floor experience
- Strong leadership and demonstrated project management skills across multi-stakeholder, cross-functional settings
- Experience with new product introduction, product/process integration, and Chip-to-Package Interaction effects
- Understanding of OSAT business landscape and operations
- Engineering fundamentals including DOE characterization, SPC, failure analysis, and problem solving
- Proficiency in statistical analysis methods and data analytics
- Strong written and spoken English communication skills
- Hands-on assembly process experience with SiC, GaN, or CIS imaging wafer technologies
- Experience in IC package design, CAD, simulation, or characterization
- Spoken Mandarin proficiency
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
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The Company
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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