ENGR SR, ETCH PROCESS

Job Summary:

onsemi is currently seeking an experienced Process Engineer to work on wafer fabrication process This person will utilize her/his knowledge, skills, and most importantly energy and willingness to learn, to take on challenges to support onsemi's technology and engineering and development on multiple fronts.  This position reports to the Senior Manager, Process Engineering

Key Duties and Responsibilities

• Own and manage the wafer dry etch process, ensuring stable performance and continuous improvement. 
• Provide technical leadership and timely solutions for day‑to‑day manufacturing issues. 
• Optimize wafer fab processes using Design of Experiments (DOE), statistical analysis, and data‑driven methodologies to improve yield, cost, quality, and cycle time. 
• Analyze failing wafers with cross‑functional teams to identify root causes and implement corrective actions, including close collaboration with suppliers and customers. 
• Support manufacturing in achieving best‑in‑class cycle time, productivity, and On‑Time Delivery (OTD). 
• Lead and participate in cross‑functional (local/global) teams on new technology development, process transfers, and new product introductions. 
• Implement error‑proofing strategies for both processes and equipment to eliminate human and machine‑related defects. 
• Establish and maintain effective process controls, work procedures, and technical documentation (including work instructions and specifications). 
• Drive continuous improvement initiatives for equipment, materials, metrology, and processes in coordination with suppliers, engineering teams, and operations. 
• Gather, analyze, and implement productivity and quality measurement systems across all factory steps. 
• Validate and ensure reproducibility of process improvements; integrate findings into equipment upgrades and product enhancements. 
• Identify, evaluate, and implement new technologies, tools, and innovative manufacturing solutions. 
• Implement and advance metrology and inspection techniques to enhance process monitoring and control. 
• Implement automation, advanced fixturing, and factory systems to improve efficiency and quality. 
• Manage equipment, process, and vendor qualifications, including capital project planning and execution. 
• Collaborate closely with Operations, Engineering, and external vendors to ensure timely and effective project execution. 
• Perform other duties as assigned.

Competencies

The ideal candidate should also have a demonstrated ability in:

• Knowledge in electronics, semiconductor technology, or solid‑state physics is preferred.
• Proficiency in Design of Experiments (DOE) and statistical methods is essential.
• Project management.
• Self-motivated, independent and hands on.
• Strong analytical and interpersonal skills are required.
• Good written and verbal communication skills.
• Ability to work in, form, and lead teams is required.
• Ability to manage multiple projects and prioritize effectively is essential.
• Experience in device failure analysis (e.g., SEM, EDX, SIMS, FIB, AFM, etc.) and device physics is strongly desired. 
• Ability to thrive in a dynamic environment and simultaneously support and coordinate multiple projects.

Requirements:

• A minimum of a Bachelor's degree in Chemical, Physics, Electrical, Electronics, or Materials Science Engineering is required.
• Experience in a wafer processing factory is preferred.
• Minimum of three years of experience in wafer fab etching processes, dry etch experience is highly preferred.