We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.
ResponsibilitiesTechnician Leadership: Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.
Machine Issue Follow-up: Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.
Equipment Maintenance & Calibration: Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.
Process Optimization: Monitor Overall Equipment Effectiveness (OEE),Uptime,production time.
Documentation: Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.
Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment:
Die Bonder: ASM AD838, AD8312PLUS, DA D510, ALPHASAM
Clip Bonder: AD830CB, AD830PLUS, BESTEM-C310
Reflow & Ovens: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)
Screen Printer: ASM DEK
Cleaning Systems: CREST,
Automated Optical Inspection (AOI): PENTAMASTER AOI
Requirements:
Education: Bachelor’s Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering.
Experience: Minimum 3–5+ years of solid engineering experience in semiconductor Front assembly (Die Bond / Clip Bond line preferred).
Technical Skills:
Expertise in ASM die bond platforms, Solder Phasa bonding mechanisms, and vision systems.
Proficient in engineering problem-solving tools (8D, FMEA, SPC, 5-Why, Fishbone).
Leadership: Proven track record of managing shift technicians and driving team performance under pressure.
Working Hours: Must be willing to support shift teams, handle escalations, and work flexible hours when required.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Skills Required
- Bachelor's Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering.
- Minimum 3-5+ years engineering experience in semiconductor front assembly (Die Bond/Clip Bond preferred).
- Hands-on experience operating, setting up, troubleshooting, or maintaining ASM die bond platforms (AD838, AD8312PLUS, DA D510, ALPHASAM).
- Hands-on experience with clip bond equipment (AD830CB, AD830PLUS, BESTEM-C310).
- Hands-on experience with reflow and oven equipment (RO830, RO832, BOCS-6) and vacuum soldering (PINK VADU).
- Experience with screen printer ASM DEK and cleaning systems (CREST).
- Experience with Automated Optical Inspection (PENTAMASTER AOI) and vision systems.
- Expertise in ASM die bond platforms, solder bonding mechanisms, and vision systems.
- Proficiency in engineering problem-solving tools: 8D, FMEA, SPC, 5-Why, Fishbone.
- Proven track record leading and managing shift technicians and driving team performance.
- Willingness to support shift teams, handle escalations, and work flexible hours.
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
onsemi Insights
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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