Power Module Design & Development Engineer at Cree (Raleigh, NC)

| Raleigh-Durham, NC
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Power Module Design & Development Engineer

What can Wolfspeed do for you?
  • Provide the opportunity to design and develop next generation power packaging & modules technologies that can significantly impact a number of energy-related applications such as electric vehicles, wind, solar, smart grid and industrial applications
  • Provide the opportunity to work on challenging, multi-disciplinary engineering problems within a team environment as well as across other teams within Wolfspeed
  • Provide the opportunity to collaborate with both materials and equipment vendors, and customers to develop the next generation power modules that will give Wolfspeed a sustainable competitive advantage
  • Provide the opportunity to design and develop prototypes using state-of-the-art electronics packaging equipment, that are then transitioned to high volume manufacturing and inserted into real world applications
  • Provide the opportunity to grow your professional career by on-site training, attending professional/engineering conferences, external certifications, publishing and filing for patents.
  • Provide the opportunity to work with some of the best and brightest engineers in the power module industry

    What can you do for Wolfspeed?
  • Interface with power electronics engineers, electrical engineers, process engineers, and production engineers to develop power module products that meet electrical, mechanical, thermal, reliability, and cost requirements (concept to production)
  • Perform design, development, and productization for transfer-molded packages and case modules, including material selection, process development, design and reliability testing
  • Perform power module prototyping and assembly
  • Lead junior engineers to conduct experiments, acquire data and perform data analysis
  • Perform thermal, mechanical, thermal-mechanical, and electrical simulations
  • Interface with the fab and SiC die design engineers to define the next generation technology platforms optimized for power module applications
  • Interface with MV/HV BU be a resource for new product definitions
  • Conduct competitive benchmarking of LV, MV, HV and SiC power modules
  • Interface with Marketing, Systems and Application Engineering teams to influence and define technology/product roadmaps
  • Must be excited to learn new design skills, modeling techniques, and operate new equipment
  • Be an out of the box thinker with a flair for combining ideas from adjacent, and sometimes unrelated disciplines, to come up with new ideas
  • Become a thought leader within the company and industry
  • Have a strategic mindset when coming up with new ideas while executing at the tactical level

    What you need for success:
  • Requires a 4-year degree and 5+ years of experience in industry, academia, or a federal research laboratory. Applicants with an M.S. or Ph.D. degree will also be given strong consideration
  • 5+ years of experience in electronics CAD design and/or modeling
  • Knowledge in industry standard and/or next generation assembly packaging processes such as wire bonding, die/substrate attach, vacuum reflow soldering, encapsulation, molding, plating, etc.
  • Knowledge or experience working with common packaging materials such as solders, ceramics, silicone gel, epoxies, polymers, etc.
  • Knowledge in Design of Experiments, 8D, and data analysis
  • Some experience in technical project planning and leadership
  • Excellent communication skills (i.e., verbal, written, and presentation)
  • Excellent team player with a can-do attitude

    Highly preferred skills and certifications:
  • CAD experience: SolidWorks®, AutoCAD®, ProE, or Creo Parametric
  • Simulation experience: COMSOL Multiphysics®, Ansys®, or SolidWorks® Simulation
  • Experience with taking a design from concept to a qualified and reliable commercial product is desirable
  • Understanding of "back of the envelope" thermal, electrical, and mechanical calculations
  • Familiar with design optimization techniques
  • Experience with power packaging prototyping
  • Experience in geometric dimensioning and tolerancing
  • Experience with DFMEA and PFMEA
  • Packaging design or development experience using statistical analysis software, such as JMP or Minitab
  • Knowledge in electronics packaging test equipment: C-SAM, x-ray, pull tester, shear tester, etc.
  • Knowledge of power module reliability and failure modes
  • Knowledge of power devices such as SiC MOSFETs, Schottky Diodes, and IGBTs
  • Understanding of and the desire to learn about interactions between SiC device parameters and final power module performance parameters and how they affect converter efficiency
  • Knowledge and use of ML/AI driven simulation & modeling tools to concurrently optimize several module performance parameters
  • Experience working in a cleanroom environment (Class 1000 or better)


We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.
More Information on Cree
Cree operates in the Semiconductor industry. The company is located in Durham, NC, Research Triangle Park, NC, Racine, WI and Goleta, CA. Cree was founded in 1987. It has 2773 total employees. It offers perks and benefits such as Flexible Spending Account (FSA), Disability Insurance, Dental Benefits, Vision Benefits, Health Insurance Benefits and Life Insurance. To see all 47 open jobs at Cree, click here.
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