Engineer, Thermal Mechanical Simulation

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Support Advance Packaging development Team - Bonding & Packaging Design

• Maintain knowledge in semiconductor and general electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Board (COB), Flip Chip, Through Silicon Vias (TSV), etc
• Detailed understanding of thermo compression bonding, wafer-to-wafer bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation.
• Knowledgeable with package design processes and guidelines
• Work with multi-functional global teams (namely Front-end design, product engineering, Technology development, Business unit, manufacturing and external programs) to fully understand and characterize manufacturing processes and packaging issues to enable simulation support with empirical validation
• Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize materials for simulation analysis
• Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation and development of simulation activities
• Provide engineering analysis to support the development and direction of the packaging materials and technologies. Develop and apply advanced design and engineering analysis to Perform Simulations
• Use Engineering and Finite Element Analysis to support Assembly Packaging TD in the following areas: predictive analysis, design optimization, material/component testing design and hardware specifications, component
• Use advanced analysis techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal, mechanical, and electro-mechanical simulation applications such as ANSYS, Icepak, Flotherm and others as needed
• Improve material characterization and techniques
• Improve simulation capabilities and techniques
• Build simulation analysis reports using software such as Word, Excel, and PowerPoint to effectively communicate analysis results and conclusions. Effectively communicate simulation analysis reports to those needing the information to support efficient package build
• Use standard documentation and storage tools such as SharePoint, EDC and OneDrive for the accurate and timely upkeep of Design Simulation documentation

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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