Huawei Canada has an immediate permanent opening for an Engineer.
About the team:
Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.
About the job:
Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
Secure patents and invention disclosures while publishing papers and internal technical reports.
The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.
About the ideal candidate:
5 years of relevant industry experiences.
PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
Deep knowledge of RF/microwave principles.
Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.
Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).
Proficiency with RF lab equipment (VNAs), probe station.
Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.
Additional Information:
Huawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs.
All applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates.
Skills Required
- At least 5 years of relevant industry experience
- PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field, or equivalent advanced R&D experience
- Deep knowledge of RF and microwave principles
- Experience with full-wave electromagnetic and circuit simulation tools for package modeling and measurement correlation
- Hands-on experience designing test vehicles and directing microelectronics assembly, including PCB, flip-chip, wire bonding, SMT, or molding
- Proficiency with RF laboratory equipment, including VNAs and probe stations
- Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing
What We Do
Founded in 1987, Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We are committed to bringing digital to every person, home and organization for a fully connected, intelligent world. We have approximately 197,000 employees and we operate in over 170 countries and regions, serving more than three billion people around the world. In Canada, Huawei conducts innovative and leading edge research in 5G technologies, along with advanced development of emerging cloud, device and network technologies & services. While our renowned Canada Research Centre in the thriving technology landscape of Ottawa, Ontario continues to grow rapidly in size and strategic product initiatives, additional presence has also been established across Canada with R&D facilities in Vancouver, Edmonton, Waterloo, Markham, Montreal, and a R&D office in Quebec City.
