The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling advanced packaging technology developments.
In this position, you will lead EMIB-T substrate technology development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams, suppliers, and assembly platform partners
Minimum Qualifications
Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
Experience listed above should be in the following:
Experience managing complex projects and deliver results in TD/high-volume manufacturing environments.
Preferred Qualifications
A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
Experience with process flow development, FMEA, DOE design, and problem-solving tools.
Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree with 6+ years of experience, or Master's degree with 4+ years, or PhD with 2+ years in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
- Experience managing complex projects and delivering results in technology development or high-volume manufacturing environments.
- Strong foundation in advanced packaging, substrates, or semiconductor manufacturing.
- Leadership experience in supplier management or technology enablement.
- Knowledge of advanced packaging technologies and substrate or assembly manufacturing methodologies.
- Familiarity with X-ray, SEM, FTIR, and EDX characterization techniques.
- Experience with process flow development, FMEA, DOE design, and problem-solving tools.
- Knowledge of statistical tools and methods, including Statistical Process Control for yield improvement.
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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