Northrop Grumman Aeronautics Systems is looking to add a Electronics Engineer / Principal Electronics Engineer (Comms Responsible Engineer) to join our team in Rancho Bernardo, CA. This position will be in our Avionics Integration Organization.
Duties and Responsibilities include, but are not limited to:
- Research, design, development, integration, and test of a variety of electronic equipment and systems, including RF datalinks, SATCOM and Communications Networks.
- Maintaining complex RF communications architectures, systems; circuitry components; analog and digital computers.
- Reporting comms status to Program Managers and IPT Management.
- Primary Responsible Engineer for complex communications subsystem, supplier technical interface, and focal IPT representative for integration support.
You will be required to work full-time, on-site at our facility. Once in the role, the position could potentially offer a hybrid work environment. Scheduled telework days are approved at manager's discretion. This position requires the ability to travel up to 25% of the time.
*This position can be filled at either the Electronics Engineer (Level 2) OR Principal Electronics Engineer (Level 3)*
Basic Qualifications:
- Electronics Engineer: Bachelor’s Degree in a STEM (Science, Technology, Engineering or Mathematics) discipline and 2 years of related engineering experience; OR a Master’s degree in a STEM discipline.
- Active in-scope, DoD Secret clearance with the ability to obtain and maintain a DoD Top Secret clearance once in position.
- Ability to obtain and maintain Special Program Access (SAP).
- Principal Electronics Engineer: Bachelor’s Degree in a STEM (Science, Technology, Engineering or Mathematics) discipline and 5 years of related engineering experience; OR a Master’s degree in a STEM discipline and 3 years of related engineering experience; OR a PhD in a STEM discipline with 1 year of related engineering experience.
- Active in-scope, DoD Secret clearance with the ability to obtain and maintain a DoD Top Secret clearance once in position.
- Ability to obtain and maintain Special Program Access (SAP).
Preferred Qualifications Both Levels:
- Active in-scope, DoD Top Secret clearance.
- Strong understanding of networking strategies including TCP/IP & WAN architectures.
- Familiar with current network products and technologies such as routers, firewalls, and switches
- RF and digital system design & analysis.
- Antenna theory and operation.
- COMMS Wideband and Narrowband integration and testing. Iridium, INMARSAT, Ku, CDL and Starlink.
- Airborne platform radio integration such ARCs.
- System Performance Verification and Component Qualifications for Flight.
- System Engineering, Requirements Derivation.
- Design documentation: E.g. Visio, Catia, interconnects and rack elevations.
Skills Required
- Bachelor's degree in a STEM discipline
- Master's degree in a STEM discipline (alternative qualification)
- PhD in a STEM discipline (alternative qualification for Principal level)
- 2 years related engineering experience (Electronics Engineer level) or equivalent
- 5 years related engineering experience (Principal Electronics Engineer level) or equivalent
- Active in-scope DoD Secret clearance
- Ability to obtain and maintain DoD Top Secret clearance
- Ability to obtain and maintain Special Access Program (SAP) eligibility
- Work full-time on-site at company facility (Rancho Bernardo, CA)
- Ability to travel up to 25% of the time
- Strong understanding of networking strategies including TCP/IP and WAN architectures
- Familiarity with network products such as routers, firewalls, and switches
- RF and digital system design and analysis experience
- Antenna theory and operation knowledge
- COMMS wideband and narrowband integration and testing experience (Iridium, INMARSAT, Ku, CDL, Starlink)
- Airborne platform radio integration experience (ARCs)
- System performance verification and component qualification for flight experience
- Systems engineering and requirements derivation experience
- Design documentation experience (Visio, Catia, interconnects, rack elevations)