Hon Hai Technology Group (Foxconn)
Jobs
Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico
Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico
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The Role
Lead the development of advanced PCBA and system integration manufacturing capabilities, collaborating with technical teams and managing manufacturing processes and technology development.
Summary Generated by Built In
Responsibilities:
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Mexico sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Mexico.
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Mexico sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Mexico.
Skills Required
- Bachelor's or Master's degree in Engineering, Material Science, Statistics, or related fields
- Minimum of 10 years in Mfg Engineering and Process/Technology Development
- Minimum 5 years in management position
- At least 5 years of experience in electronic manufacturing within a Contract Manufacturer environment
- Knowledge of PCBA with large size BGA, Co-Packaged Optics, etc.
- Strong English communication skills
- Ability to lead projects from beginning to end
- Ability to work under pressure
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The Company
What We Do
Hon Hai Technology Group (Foxconn) is the world's largest electronics manufacturer and a leading technological solution provider, established in Taiwan in 1974. It leverages expertise in software and hardware to integrate manufacturing systems with emerging technologies, expanding into electric vehicles, digital health, and robotics, with a focus on AI, semiconductors, and next-generation communications.
