Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico

Reposted 15 Days Ago
Be an Early Applicant
Hiring Remotely in Guadalajara, Jalisco, MEX
Remote
10-10 Annually
Expert/Leader
Hardware • Information Technology • Robotics • Manufacturing
The Role
Lead the development of advanced PCBA and system integration manufacturing capabilities, collaborating with technical teams and managing manufacturing processes and technology development.
Summary Generated by Built In
Responsibilities:
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Mexico sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Mexico.
 

Skills Required

  • Bachelor's or Master's degree in Engineering, Material Science, Statistics, or related fields
  • Minimum of 10 years in Mfg Engineering and Process/Technology Development
  • Minimum 5 years in management position
  • At least 5 years of experience in electronic manufacturing within a Contract Manufacturer environment
  • Knowledge of PCBA with large size BGA, Co-Packaged Optics, etc.
  • Strong English communication skills
  • Ability to lead projects from beginning to end
  • Ability to work under pressure

Hon Hai Technology Group (Foxconn) Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Hon Hai Technology Group (Foxconn) and has not been reviewed or approved by Hon Hai Technology Group (Foxconn).

  • Healthcare Strength Health coverage in the U.S. includes medical, dental, and vision, supported by EAP services and on‑campus or site health resources in some regions. These offerings align with large‑employer standards and are publicly emphasized across multiple locations.
  • Retirement Support Retirement provisions include a U.S. 401(k) plan and a formal pension framework in Taiwan that follows local law. This provides structured long‑term savings mechanisms across major geographies.
  • Parental & Family Support Family‑oriented benefits include childbirth allowances and transportation subsidies during pregnancy, with additional welfare programs and childcare supports referenced in corporate materials. These supports broaden the non‑salary value proposition in several regions.

Hon Hai Technology Group (Foxconn) Insights

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The Company
HQ: New Territories
2,425 Employees
Year Founded: 1974

What We Do

Hon Hai Technology Group (Foxconn) is the world's largest electronics manufacturer and a leading technological solution provider, established in Taiwan in 1974. It leverages expertise in software and hardware to integrate manufacturing systems with emerging technologies, expanding into electric vehicles, digital health, and robotics, with a focus on AI, semiconductors, and next-generation communications.

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