Responsibilities:
- Lead the architecture, design, and development of analog and mixed-signal IPs for beam steering applications.
- Manage and lead a team of analog mixed circuit and analog design engineers.
- Collaborate with cross-functional teams including optics, digital/ASIC, packaging, and testing to ensure robust integration of analog systems.
- Drive the design and optimization of key functional blocks such as DACs, ADCs, LDOs, row/column drivers, and output buffers.
- Oversee simulations, physical implementation, tape-out, and bring-up of mixed-signal ICs.
- Provide hands-on technical guidance and mentorship to the analog design team.
- Interface with foundry partners to evaluate and select optimal CMOS process nodes.
- Ensure successful silicon validation and characterization through lab measurements and debugging.
- Contribute to the development and execution of the technology roadmap for analog and mixed-signal IP.
Qualifications:
- PhD or MS in Electrical Engineering or related field with 10+ years of experience in analog and mixed-signal IC design
- At least 8 years of prior people management experience.
- Proven track record of delivering first-pass functional silicon for complex mixed-signal ASICs, especially in CMOS technologies optimized for image sensors or display drivers.
- Deep understanding of analog display driver circuits including active-matrix architectures, row/column drivers, DAC/ADC design, LDOs, and output buffers.
- Strong expertise in low-power, high-precision analog design techniques.
- Hands-on experience with transistor-level design tools (e.g., Cadence Virtuoso, AMS design flows).
- In-depth knowledge of process technology and device physics, preferably from leading foundries.
- Proficiency in lab testing and silicon debugging using oscilloscopes, spectrum analyzers, signal generators, etc.
- Experience with active-matrix display systems and analog circuit characterization.
- Exceptional communication skills, both verbal and written, with the ability to present complex technical concepts clearly.
- Demonstrated leadership in managing and mentoring high-performing analog design teams.
- Experience in high-volume production and yield optimization of analog/mixed-signal chips.
- Familiarity with multi-stack die technology, including through-silicon vias (TSVs), wafer-to-wafer bonding, and 3D integration techniques
What We Do
Lumotive’s transformative optical semiconductors are enabling “Lidar 2.0” for consumer electronics, industrial automation, robotics, and automotive applications. The company’s Meta-Lidar™ Reference Platform utilizes revolutionary beam-steering technology based on patented Light Control Metasurfaces™ and implemented in standard semiconductor manufacturing processes to deliver an unprecedented combination of best-in-class performance, cost, reliability and size. Lumotive’s LCMs enable the industry’s first software-defined lidar with advanced perception capabilities. Lumotive’s Meta-Lidar™ Platform was recently recognized with two CES 2022 Innovation awards, a 2022 SPIE Prism Award, a Business Intelligence Group Excellence in Artificial Intelligence Award, and a prestigious Edison Award. Investors include Bill Gates, Samsung Ventures, Quan Funds and MetaVC Partners.







