Responsibilities:
- Lead the architecture, design, and development of analog and mixed-signal IPs for beam steering applications.
- Collaborate with cross-functional teams including optics, digital/ASIC, packaging, and testing to ensure robust integration of analog systems.
- Drive the design and optimization of key functional blocks such as DACs, ADCs, LDOs, row/column drivers, and output buffers.
- Oversee simulations, physical implementation, tape-out, and bring-up of mixed-signal ICs.
- Provide hands-on technical guidance and mentorship to the analog design team.
- Interface with foundry partners to evaluate and select optimal CMOS process nodes.
- Ensure successful silicon validation and characterization through lab measurements and debugging.
- Contribute to the development and execution of the technology roadmap for analog and mixed-signal IP.
Qualifications:
- PhD or MS in Electrical Engineering or related field with 10+ years of experience in analog and mixed-signal IC design.
- Proven track record of delivering first-pass functional silicon for complex mixed-signal ASICs, especially in CMOS technologies optimized for image sensors or display drivers.
- Deep understanding of analog display driver circuits including active-matrix architectures, row/column drivers, DAC/ADC design, LDOs, and output buffers.
- Strong expertise in low-power, high-precision analog design techniques.
- Hands-on experience with transistor-level design tools (e.g., Cadence Virtuoso, AMS design flows).
- In-depth knowledge of process technology and device physics, preferably from leading foundries.
- Proficiency in lab testing and silicon debugging using oscilloscopes, spectrum analyzers, signal generators, etc.
- Experience with active-matrix display systems and analog circuit characterization.
- Exceptional communication skills, both verbal and written, with the ability to present complex technical concepts clearly.
- Demonstrated leadership in managing and mentoring high-performing analog design teams.
- Experience in high-volume production and yield optimization of analog/mixed-signal chips.
- Familiarity with multi-stack die technology, including through-silicon vias (TSVs), wafer-to-wafer bonding, and 3D integration techniques
Top Skills
What We Do
Lumotive’s transformative optical semiconductors are enabling “Lidar 2.0” for consumer electronics, industrial automation, robotics, and automotive applications. The company’s Meta-Lidar™ Reference Platform utilizes revolutionary beam-steering technology based on patented Light Control Metasurfaces™ and implemented in standard semiconductor manufacturing processes to deliver an unprecedented combination of best-in-class performance, cost, reliability and size. Lumotive’s LCMs enable the industry’s first software-defined lidar with advanced perception capabilities. Lumotive’s Meta-Lidar™ Platform was recently recognized with two CES 2022 Innovation awards, a 2022 SPIE Prism Award, a Business Intelligence Group Excellence in Artificial Intelligence Award, and a prestigious Edison Award. Investors include Bill Gates, Samsung Ventures, Quan Funds and MetaVC Partners.






