Digital Design Engineer

Posted Yesterday
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Saint-Sulpice, QC, CAN
Hybrid
Senior level
Artificial Intelligence • Hardware • Semiconductor
The Role
Design and verify high-speed digital circuits for serial transceivers, DDR, and memory interfaces. Responsibilities include RTL design, analog-digital interface specification, synthesis, timing analysis, verification, chip integration, protocol analysis, and post-silicon lab bring-up. The engineer will collaborate with analog, verification, physical implementation, and customer teams while supporting requirements, debugging, characterization, and product delivery.
Summary Generated by Built In

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

 

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

 

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

We are actively seeking for a Digital Design Engineer

Location: Lausanne (St-Sulpice), Switzerland

Responsibility

  • Concept definition, analog to digital interface specification

  • RTL design with basics of Dft and IP verification

  • Logic synthesis, Timing analysis – desired

  • Close interaction with Verification engineers, Analog/Mixed signal designers

  • Develop block level specifications of very high-speed digital circuits that meet key performance targets based on system level requirement

  • Design and verification of very high-speed digital circuits

  • Support for post-silicon lab bring-up, debug, characterization and productization

  • Analysis and understanding of high-speed serial protocols (e.g., USB4, PCIe)

  • Analog/digital interface specification in close cooperation with analog/mixed-signal designers

  • Validation and bring-up of chips in the lab

  • Close interaction with verification and physical implementation engineers to verify circuit functionality and compliance with area, timing, and power requirements

  • Support and interact with customers on requirements, design specifications, performance results and product delivery

  • Support IP and chip level integration

  • Manage workload and schedules and report to internal management team and external customers

Required Experience

  • 5-10 years’ experience in digital design of key circuits in multi-Gigabit serial data-link transceivers, DDR and low power high performance modern memory interfaces and experience in the semiconductor industry

  • Strong technical background in design of high-speed digital circuits in deep-submicron CMOS technologies

  • Proven experience in complex digital design and verification of data processing systems

  • Proven experience in design and verification of complex regulation systems (configuration, calibration, and dynamic adaption)

  • Experience in industry standard design EDA tools for design, simulation, and verification

  • Experience in digital high-speed blocks, CMOS High Speed interface competence would be a preference

  • Exposure to the Cadence toolset

  • Experience with multi-Gigabit serial data transceivers is highly desirable

  • Experience with analog/digital control interfaces is valuable

Required Skills

  • Strong interest in the design of digital circuits and blocks for multi-Gigabit serial ana parallel data-link transceivers, DDR and low power high performance memory and communication interfaces

  • Strong scripting and tool setup skill

  • Strong analytical skills to translate system-level requirements into design

  • Self-motivated, with strong sense of ownership and responsibility. Good communicator and team player

  • RTL coding skills, CDC and Linting knowledge

  • Understanding of verification tools and methodologies is an advantage

  • Knowledge of synthesis, STA and signal processing techniques is an advantage

  • Advanced knowledge of high-speed and low-power design techniques and high-speed serial protocols

  • Scripting (Python preferred) and tool setup skills

Required Education

  • Proven experience and/or Masters or Ph.D. in E.E., Communications or other relevant fields


  • MSc in electronics/electrical engineering (equivalent or higher)

https://kandou.ai/

 

Skills Required

  • 5-10 years of experience in digital design of multi-Gigabit serial data-link transceivers, DDR, and low-power high-performance memory interfaces
  • Experience in the semiconductor industry
  • Strong background in high-speed digital circuit design using deep-submicron CMOS technologies
  • Experience designing and verifying complex digital data-processing systems
  • Experience designing and verifying configuration, calibration, and dynamic-adaptation regulation systems
  • Experience with industry-standard EDA tools for design, simulation, and verification
  • RTL coding skills, including CDC and linting knowledge
  • Strong scripting and tool setup skills
  • Proven experience or a Master's or Ph.D. degree in electrical engineering, communications, or a related field
  • MSc in electronics or electrical engineering, or equivalent or higher
  • Cadence toolset experience
  • Experience with multi-Gigabit serial data transceivers
  • Experience with high-speed digital blocks and CMOS high-speed interfaces
  • Experience with analog/digital control interfaces
  • Understanding of verification tools and methodologies
  • Knowledge of synthesis, static timing analysis, and signal processing techniques
  • Python scripting experience
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The Company
222 Employees

What We Do

Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.

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