Intel Ireland Device Engineering team (Yield department) is looking for Device Engineering talents (reporting to manger of Device team) to join our advanced technology Fab.
As a Device Engineer/Senior Device Engineer, you will focus on most advanced FinFETs technology device engineering/development working closely with Integration, Module, yield teams to achieve yield ramp-up, process and device optimization in the high-volume manufacturing Fab, supporting internal and external customers.
Device engineers' responsibilities include (but are not limited to):
Drive factory product Power and Performance roadmap and member/leader of the Performance TMI team to ensure the factory products hit customer specifications required, including device targeting, customization, variability improvement etc.
Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.
Work with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs.
Participate or lead cross-organizational team of engineers to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production yield/performance targets.
Own NPI (New Product Introduction) in production fab and perform device-related process optimizations to meet foundry customers product specifications and requirements.
Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to maintain baseline device performance.
Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities in line.
Level of experience will be considered in determining applicants job grade.
Qualifications:
Candidate should possess the following behavioral skills:
Skills Required:
Problem Solving: Demonstrated experience in rapidly analyzing complex process problems and identifying effective solution paths.
Teamwork and Partnership: Strong teamwork skills and the ability to build effective partnerships.
Communication: Excellent written and verbal communication skills, with the ability to summarize and communicate information effectively to influence action at all levels.
Self-Motivation: A motivated self-starter with the ability to work independently as well as collaboratively in a team environment.
Flexibility: Maturity and adaptability in facing uncertainties and changing priorities or responsibilities.
Goal Commitment: Commitment to achieving aggressive goals with a positive, can-do attitude and ability to act with velocity and a strong sense of urgency.
Qualifications:
Minimum Qualifications:
Relevant Bachelors, Masters and/or a PhD degree in Device physics, Electronics, physics chemistry or related technical field.
5-10 years' experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration.
5-10 years' experience in FinFET technology development or high-volume manufacturing.
5-10 years' experience with Device Physics and hands-on application in real-world fab environment.
Preferred Qualifications:
Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major.
Experience driving product performance roadmaps working in multi discipline team with Process Engineers, Integration Engineers and Yield Analysis to deliver reliable, cost effective and stable/capable products.
Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.
Demonstrated interpersonal skills including influencing, engaging, and motivating.
Experience in serving external Foundry customers through technical interactions.
Experience in GAA (Gate-All-Around) technology architecture.
Experience in new semiconductor technology development.
Basic understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.
Job Type:Experienced HireShift:Shift 1 (Ireland)Primary Location: Ireland, LeixlipAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
EU Salary
We offer a total compensation package that ranks among the best in the industry.
Annual Salary Range for this job which could be performed in Ireland is: €71,300.00 - €111,300.00 The compensation range displayed in this posting reflects the minimum and maximum target compensation for this position. Within this range, individual pay is determined by job related skills, experience, and relevant education, training. As part of our total compensation approach, the final offer may include additional pay components and benefits. Your recruiting team will share the confirmed base salary along with any applicable total compensation elements upon employment offer delivery.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
Skills Required
- Bachelor's, Master's or PhD in Device Physics, Electronics, Physics, Chemistry or related technical field.
- 5-10 years' experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration.
- 5-10 years' experience in FinFET technology development or high-volume manufacturing (HVM).
- 5-10 years' hands-on experience with Device Physics in a real-world fab environment.
- Demonstrated problem solving for complex process issues.
- Strong teamwork and partnership skills.
- Excellent written and verbal communication skills.
- Self-motivation and ability to work independently and in teams.
- Flexibility and adaptability to changing priorities.
- Commitment to achieving aggressive goals with urgency.
- Ability to work on-site in Leixlip, Ireland (Shift 1).
- Advanced degree (Master's or PhD) in Electrical Engineering, Physics or Materials Science.
- Experience driving product performance roadmaps with multi-discipline teams (Process, Integration, Yield).
- Experience with process transfers to High Volume Manufacturing and solving integrated yield/performance issues.
- Experience serving external foundry customers through technical interactions.
- Experience with GAA (Gate-All-Around) technology architecture.
- Experience in new semiconductor technology development.
- Basic understanding/collaboration experience with module processes: lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Parental & Family Support — Family-building and caregiving supports are extensive, including fertility coverage, adoption assistance, paid parental leave, childcare and elder care resources, and a structured reintegration for new parents. These benefits are positioned as best-in-class elements of the package.
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Leave & Time Off Breadth — Time off includes generous PTO, a paid sabbatical after extended tenure, and multiple leave types such as family, medical, bereavement, and military. This breadth enables employees to disconnect, recharge, and manage life events.
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Retirement Support — Long-term savings are bolstered by a competitive 401(k) match and access to deferred compensation for eligible levels, alongside stock purchase opportunities. These programs are highlighted as strong tools for financial security.
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