At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Characterization Engineer for our lab in Switzerland (Lausanne)
Responsibility
Lead end-to-end characterization of high-speed SerDes operating at symbol rates above 20 Gbaud
Perform jitter, eye-diagram, BER, and margin measurements across PVT
Characterize full transmitter and receiver electrical parameters
Perform S-parameter, TDR and insertion loss measurements
Collaborate with IP architects, digital and analog design teams
Documentation of test results and procedures
Write and architect test scripts for automation in Python
Required Experience
Proven experience characterizing silicon devices over PVT.
Proven experience using lab equipment, such as: high-speed oscilloscopes, VNAs, and Spectrum Analyzers.
Experience defining test plans and test procedures
Experience with Python, or other object-oriented programming for test automation, data analysis and report generation
Experience with PAM modulation or multi-tonal modulation schemes is a plus
Experience in SerDes characterization is a plus
At least 5 years of relevant work experience
Required Competencies
Self-motivated, with a strong sense of ownership and responsibility
Good communicator and team player, with experience working in cross-functional teams
Strong interest in characterizing high-speed analog circuits
Solid understanding or ability to learn SI concepts, modulation schemes, TX and RX fundamentals
Experience with Python or other object-oriented languages
Experience using high-speed oscilloscopes, VNAs, and Spectrum Analyzers
Ability to multitask in a high energy environment
Schematic entry or PCB design is a plus
Required Education
Bachelor´s or Master´s degree in EE, CE, or equivalent work experience
Profiles submitted by third-party recruitment agencies will not be taken into consideration.
Skills Required
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or equivalent experience
- At least 5 years of relevant work experience
- Experience characterizing silicon devices over process, voltage, and temperature
- Experience using high-speed oscilloscopes, VNAs, and spectrum analyzers
- Experience defining test plans and procedures
- Experience with Python or other object-oriented programming for test automation, data analysis, and report generation
- Experience with SerDes characterization
- Experience with PAM or multi-tonal modulation schemes
- Schematic entry or PCB design experience
- Strong understanding of signal integrity concepts, modulation schemes, and transmitter and receiver fundamentals
- Ability to work cross-functionally and communicate effectively
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
