CAD/EDA Manager

Reposted 3 Days Ago
Be an Early Applicant
2 Locations
In-Office
220K-255K Annually
Senior level
Artificial Intelligence • Machine Learning • Semiconductor
We’re building the first programmable light-speed computer.
The Role
Lead EDA tooling and physical design infrastructure for analog/mixed-signal IC teams: evaluate and deploy Cadence/Spectre/Calibre toolflows, manage PDKs and TSMC N3P/N2P enablement, architect CAD compute clusters, develop SKILL/Python/Tcl automation, manage licenses/version control, liaise with foundries/vendors, provide hands-on tape-out support, and drive methodology improvements to improve designer productivity and first-pass silicon success.
Summary Generated by Built In
About Neurophos

The demand for new datacenters and AI compute is rapidly outpacing the planet's energy capacity. Digital solutions are hitting a power wall as we approach the physical limits of traditional silicon. Conquering this bottleneck isn’t about bigger chips or more of them; it means rethinking the fundamental architecture. The industry's current path isn’t going to meet the need, so we took a different approach.

Instead of traditional electronic circuits, we use silicon photonics and an active, programmable metasurface to perform matrix multiplications at the speed of light. Our optical cells are 10,000x smaller than traditional photonic components, enabling unprecedented density. By using photonics instead of electricity, our chips become more efficient as they scale. This architecture will deliver up to 100 times the energy efficiency of existing solutions while significantly improving performance for large-scale AI inference.

We’ve assembled a world-class team of industry veterans and recently raised a $110M Series A led by Gates Frontier. Participants include M12 (Microsoft’s Venture Fund), Carbon Direct Capital, Aramco Ventures, Bosch Ventures, Tectonic Ventures, Space Capital, and others. We have also been recognized on the EE Times Silicon 100 list for several consecutive years.

Join us and shape the future of computing!

Position Overview

We are seeking an experienced CAD Manager to lead and manage the EDA tooling, design flows, and physical design infrastructure for our analog and mixed-signal IC design teams. In this role, you will be responsible for evaluating and deploying EDA tools, developing robust custom flows from schematic capture through tape-out, and ensuring maximum designer productivity across multiple process nodes. You will work closely with design, verification, and process engineering teams to solve the toughest implementation challenges in advanced analog design.

Location

Austin, TX or San Jose, CA. Full-time onsite position.

Key Responsibilities

EDA Tool and Flow Management

  • Evaluate, deploy, and support EDA tools, including Cadence Virtuoso, Spectre, Calibre, and related analog/custom IC toolsets.

  • Develop, maintain, and optimize design flows for schematic entry, simulation, layout, parasitic extraction (PEX), and physical verification (DRC/LVS).

  • Manage EDA tool licenses, vendor relationships, and tool upgrade cycles to ensure the design team’s productivity.

  • Implement and maintain PDK installations and updates, coordinating with foundry partners (including TSMC) for process node enablement, with specific focus on advanced technology qualification and ramp.

  • Lead CAD enablement for TSMC N3P and N2P advanced nodes, including PDK bring-up, design rule updates, fill strategy, and integration / sign-off flow alignment with TSMC requirements.

  • Interface with foundries and VCA partners to facilitate a smooth tape-out process.

Infrastructure and Automation

  • Architect and maintain the CAD computing environment, including Linux workstations, EDA servers, and LSF/grid computing clusters.

  • Develop and maintain SKILL, Tcl, Python, and shell scripts to automate repetitive CAD tasks and streamline designer workflows.

  • Manage design data integrity through version control systems (Git, Vault, ClearCase) and define backup and archive strategies.

  • Collaborate with IT to plan compute resource needs, capacity planning, and infrastructure upgrades.

Team Leadership and Collaboration

  • Act as the primary technical liaison between design teams, foundries, and EDA vendors.

  • Define and enforce CAD best practices, design methodology guidelines, and tape-out checklists.

  • Provide hands-on debug support for flow and tool issues during critical project phases and tape-out windows.

  • Drive continuous improvement initiatives to reduce design cycle time and improve first-pass silicon success rates.

Qualifications
  • B.S. or M.S. in Electrical Engineering, Computer Engineering, or a closely related field.

  • 8+ years of hands-on experience in analog/mixed-signal IC CAD or EDA engineering.

  • Deep expertise in Cadence Virtuoso suite (schematic, layout, ADE), Spectre/Spectre X simulation, and Cadence Virtuoso SKILL scripting.

  • Strong knowledge of physical verification tools: Mentor Calibre (DRC, LVS, PEX) and/or Synopsys IC Validator.

  • Proven experience with PDK integration and support for advanced CMOS nodes; hands-on experience with TSMC N3P and/or N2P process nodes strongly preferred.

  • Familiarity with TSMC design rule documents (DRM), analog design guidelines (ADG), and tape-out sign-off requirements for N3P/N2P.

  • Proficiency in at least two scripting languages: Python, SKILL, Tcl, or Perl.

  • Experience managing EDA tool licensing (FlexLM/RLM) and floating license optimization.

  • Strong understanding of Linux/Unix computing environments and HPC cluster management.

Preferred Skills
  • Experience with custom digital/mixed-signal flows, including OpenAccess, Virtuoso Layout Suite XL, or Virtuoso RF.

  • Familiarity with post-layout simulation (EMIR, noise, reliability) methodologies.

  • Knowledge of EM/IR analysis tools (Voltus, RedHawk) applied to analog/custom blocks.

  • Prior people management or technical lead experience in a tape-out-oriented environment.

  • Experience with high-speed I/O, SerDes, PLLs, or RF circuit design CAD flows.

  • Familiarity with configuration management tools and agile project tracking (SOS, JIRA, Confluence).

What We Offer

This is an opportunity to play a pivotal role in an innovative startup redefining the future of AI hardware. Work on a game-changing technology at the intersection of photonics and AI as part of a collaborative and brilliant team. You’ll contribute to a platform that redefines computational performance and accelerates the future of artificial intelligence. Come help us bring this transformative technology to the world.

Benefits

Join a team that invests in your future and your well-being. At Neurophos, we offer:

  • 100% coverage of base health plan premiums for you and your dependents, plus HSA contributions.

  • Unlimited PTO. No rigid vacation banks, just a focus on delivery.

  • 401(k) matching and stock option opportunities to ensure our success is your success.

  • Full suite of voluntary benefits, including Dental, Vision, Life, Hospital, Critical Illness, and Accident insurance.

  • Personalized Benefits. Choose the plans that fit your life and take the cash back for those that don’t.

Skills Required

  • B.S. or M.S. in Electrical Engineering, Computer Engineering, or closely related field.
  • 8+ years hands-on experience in analog/mixed-signal IC CAD or EDA engineering.
  • Deep expertise in Cadence Virtuoso suite (schematic, layout, ADE) and Spectre/Spectre X; Cadence SKILL scripting.
  • Strong knowledge of physical verification tools: Mentor Calibre (DRC, LVS, PEX) and/or Synopsys IC Validator.
  • Proven experience with PDK integration and support for advanced CMOS nodes.
  • Familiarity with TSMC design rule manuals (DRM), analog design guidelines (ADG), and tape-out sign-off requirements.
  • Proficiency in at least two scripting languages (Python, SKILL, Tcl, or Perl).
  • Experience managing EDA tool licensing (FlexLM/RLM) and floating license optimization.
  • Strong understanding of Linux/Unix computing environments and HPC cluster (LSF/grid) management.
  • Experience with version control and design data management (Git, Vault, ClearCase).
  • Lead CAD enablement and interface with foundries/VCA partners for tape-out coordination.
  • Hands-on experience with TSMC N3P and/or N2P process nodes.
  • Experience with custom digital/mixed-signal flows and OpenAccess, Virtuoso Layout Suite XL, or Virtuoso RF.
  • Familiarity with post-layout simulation methodologies (EMIR, noise, reliability).
  • Knowledge of EM/IR analysis tools such as Voltus and RedHawk.
  • Prior people management or technical lead experience in a tape-out oriented environment.
  • Experience with high-speed I/O and analog/RF building blocks (SerDes, PLLs, RF) CAD flows.
  • Familiarity with configuration management and agile project tools (SOS, JIRA, Confluence).

Neurophos Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Neurophos and has not been reviewed or approved by Neurophos.

  • Healthcare Strength Job postings indicate the company covers 100% of base health plan premiums for employees and dependents and contributes to HSAs. Listings also reference dental, vision, and other voluntary coverages.
  • Leave & Time Off Breadth Unlimited PTO is advertised with an emphasis on delivery rather than accruals. Notes in postings suggest clarifying typical usage and any minimums.
  • Retirement Support A 401(k) with employer matching is listed alongside stock option opportunities. This pairing signals structured retirement support in addition to equity participation.

Neurophos Insights

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The Company
HQ: Austin, TX
40 Employees
Year Founded: 2020

What We Do

Neurophos is an Austin-based semiconductor company developing high-performance, energy-efficient photonic AI inference chips. Instead of traditional electronic circuits, we use silicon photonics and an active, programmable metasurface to perform matrix multiplications at the speed of light. Our optical cells are 10,000x smaller than traditional photonic components, enabling unprecedented density for an optical system. As AI adoption accelerates, data centers face significant power and scalability challenges. Traditional solutions are struggling to keep up, leading to rapidly rising energy consumption and costs. We’re solving both problems with an OPU that integrates over one million micron-scale optical processing components on a single chip. This architecture will deliver up to 100 times the energy efficiency of existing solutions while significantly improving large-scale AI inference performance. We’ve assembled a world-class team of industry veterans and recently raised a $110M Series A led by Gates Frontier. Participants include M12 (Microsoft’s Venture Fund), Carbon Direct Capital, Aramco Ventures, Bosch Ventures, Tectonic Ventures, Space Capital, and others. We have also been recognized on the EE Times Silicon 100 list for several consecutive years. Join us and shape the future of optical computing!

Why Work With Us

This is an opportunity to work on a game-changing technology at the intersection of photonics and AI. You’ll contribute to a platform that redefines computational performance and accelerates the future of artificial intelligence.

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