We are looking for a Strategic Business Development Manager to accelerate Wolfspeed's entry and growth in the advanced packaging market across a broad and fast-evolving set of emerging platforms — including AI and high-performance computing (HPC), co-packaged optics (CPO) and silicon photonics, quantum computing, and augmented/virtual reality (AR/VR). This role will be a critical driver of our go-to-market strategy for SiC in 2.5D/3D packaging architectures — identifying design-in opportunities, forging ecosystem partnerships, and securing long-term engagements with chipmakers, foundries, OSATs, EDA players, photonics and optical-module vendors, quantum hardware developers, and AR/VR device makers. The ideal candidate combines a deep understanding of advanced semiconductor packaging with a strong commercial mindset, intellectual curiosity about adjacent and nascent applications, and a proven track record of building high-value relationships across the AI chip, photonics, quantum, and immersive-computing supply chains.
The ideal candidate will be located in the San Francisco Bay Area or Phoenix, Arizona.
Key Responsibilities
- Market Expansion: Identify and develop new business opportunities for SiC in advanced packaging applications — including backside cooling layers, passive interposers, and active interposers — across a range of high-growth markets such as AI accelerators and HPC, co-packaged optics and optical I/O, quantum computing systems, and AR/VR platforms (e.g., compact high-density modules, optical engines, photonic interposers, and display driver integration for headsets and smart glasses). Remain open to additional emerging use cases where SiC's material properties create differentiated value.
- Ecosystem Partnerships: Build executive-level relationships with leading AI chip designers (e.g., hyperscalers, GPU/ASIC OEMs), foundries (e.g., TSMC), OSATs, EDA players, photonics/CPO and optical-module suppliers, quantum hardware developers, and AR/VR OEMs and silicon teams to secure design-ins, joint development programs, and long-term supply agreements.
- Strategic Growth Initiatives: Drive co-development programs and PDK-led engagements that embed SiC into customer packaging design flows across AI, HPC, co-packaged optics, quantum, and AR/VR use cases, converting material expertise into durable ecosystem lock-in.
- Deal Structuring & Negotiation: Lead strategic contracts, licensing, and partnership negotiations — balancing revenue growth, risk mitigation, and long-term scalability in nascent but fast-growing markets.
- Voice of Customer: Work closely with materials, technology development, and applications engineering teams to align growth initiatives with SiC process capabilities and packaging integration requirements across data center, photonics, quantum, and immersive-device form factors.
- Cross-Functional Leadership: Work closely with materials, technology development, and applications engineering teams to align growth initiatives with SiC process capabilities and packaging integration requirements across data center and immersive-device form factors.
- Market Intelligence: Monitor competitor activities, foundry roadmaps, AI hardware trends, to shape business development strategy and positioning for SiC.
Qualifications
- Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
- 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain.
- Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration), interconnect technologies (TSV, TSiCV, RDL, hybrid bonding), and thermal management constraints in AI/HPC systems.
- Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers.
- Proven track record in securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers.
- Exceptional negotiation, communication, and executive relationship-building skills.
- Willingness to travel globally.
- Experience developing strategic account plans for key accounts consistent with business unit strategies.
- Ability to qualify opportunities and determine fit for SiC packaging materials across the AI chip supply chain.
- Passion for building breakthrough growth in an emerging, technically complex market.
We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.
Skills Required
- Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
- 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain.
- Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration) and interconnect technologies (TSV, TSiCV, RDL, hybrid bonding).
- Knowledge of thermal management constraints in AI/HPC systems and ability to communicate SiC's technical value proposition to engineering and executive audiences.
- Proven track record securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers.
- Exceptional negotiation, communication, and executive relationship-building skills.
- Willingness to travel globally.
- Experience developing strategic account plans for key accounts aligned with business unit strategies.
- Ability to qualify opportunities and determine fit for SiC packaging materials across the AI chip supply chain.
- Passion for building breakthrough growth in an emerging, technically complex market.
- Ideal candidate located in the San Francisco Bay Area or Phoenix, Arizona.
Cree Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cree and has not been reviewed or approved by Cree.
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Fair & Transparent Compensation — Pay is often described as fair or decent in technician and operator roles. Compensation in some project management and security supervision roles is characterized as good.
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Healthcare Strength — Benefits include medical, dental, and vision coverage with HSA, FSA, and HRA options, plus EAP support. Wellness resources are highlighted alongside core health plans.
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Parental & Family Support — The package includes six weeks of paid parental leave and adoption assistance. Leave applies to new birth, adoption, and foster placement.
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What We Do
Cree | Wolfspeed is the global leader in silicon carbide technology and production, leading the worldwide transition from silicon to silicon carbide. Our product portfolio provides disruptive technology solutions that support a more efficient, sustainable future including electric vehicles, fast charging, 5G, power supplies, renewable energy and storage, as well as aerospace and defense. Our people are dedicated to driving a significant shift in the technology sector and creating a global semiconductor powerhouse. For additional product and Company information, visit www.cree.com.
