- Drive yield improvement at the BGA devices assigned to him/her .
- Drive WB LOH align to NXP Goal and meet customer on time delivery.
- Work with NPI team to establish NPI products like WB recipes creation and verification for BGA packages
- Support productivity and cost savings
Requirements:
- Bachelor/Master degree in Electronics or Mechanical Engineering
- Good knowledge with FMEA, control plan, SPC, DOE, and process flow is an advantage
- Possesses good positive attitude and team player
- Willingness to learn in WB process with hands-on to the machine
More information about NXP in Malaysia...
#LI-633aSkills Required
- Bachelor’s or Master’s degree in Electronics Engineering or Mechanical Engineering
- Knowledge of FMEA, control plans, SPC, DOE, and process flow
- Positive attitude and ability to work as a team player
- Willingness to learn the wire-bonding process and perform hands-on machine work
What We Do
NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
