Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel's advanced chip packaging process technology.
In this position, you will be directly responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next generation semiconductor packaging technology. Your responsibilities include, but are not limited to:
- Development of handling process recipes, design/validation of nozzle tooling, and addressing process/equipment issues on the manufacturing floor while delivering to our quality and reliability standards.
- Engaging in testing and validating hardware/software upgrades to meet product requirements.
- Develop solutions to meet customer requirements from platform specification to validation, deployment and proliferation to high volume manufacturing sites.
- Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
- Apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
Minimum Qualifications:
- Possess a Bachelor's or Master's degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
- Have at least 1 year of work experience.
- Experience with and fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
- Fundamental understanding of semiconductor devices and packing technology.
Preferred Qualifications:
- Proven development & deployment experience in factory automated material handling systems, including Autonomous Mobile Robot (AMR)/Automated Guided Vehicle (AGV), conveyor systems, stockers, automated storage solutions and manufacturing equipment integration. Familiarity with advanced autonomous manufacturing concepts (Level 5 & above automation) is preferred.
- Strong kinematics / motion control / vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
- Mechanical design experience (CAD, Solidwork, GD and T) is preferred.
- Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE).
- Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
Job Type:Experienced HireShift:Shift 1 (Malaysia)Primary Location: Malaysia, KulimAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor’s or Master’s degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering, or a related STEM field
- At least 1 year of work experience
- Fundamental understanding of motion control, high-accuracy and high-speed robotic systems, and vision systems
- Fundamental understanding of semiconductor devices and packaging technology
- Development and deployment experience with automated material handling systems, including AMRs, AGVs, conveyors, stockers, automated storage, and manufacturing equipment integration
- Strong kinematics, motion control, and vision systems background, including high-speed, high-accuracy pick-and-place and 2D vision systems
- Mechanical design experience with CAD, SolidWorks, and GD&T
- Strong understanding of statistical principles, SPC, and DOE
- Ability to apply scientific and engineering principles to develop solutions for high-volume manufacturing processes
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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