ASIC Implementation Engineer

Posted 13 Days Ago
Be an Early Applicant
San Jose, CA, USA
In-Office
144K-230K Annually
Expert/Leader
Software • Semiconductor • Manufacturing
The Role
Lead top-level ASIC floorplanning and physical design from RTL to tape-out. Own chip floorplanning, partitioning, clock tree delivery, I/O/bump planning, cross-functional integration, vendor/IP evaluation, and methodology improvements.
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Job Description:

Broadcom is searching for an ASIC top level floorplan Physical Design Engineer to join the Asic Products Division. This position involves working with the latest technology to continue driving next generation Artificial Intelligence and  PCIe Switch Products. More specifically, this position will require in-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape-out.

Responsibilities:

  • Own chip floor planning, partition creation, clock tree and delivery of top level partitions 

  • Resolve physical design issues related to chip integration and assembly

  • Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team

  • Develop and improve floorplan implementation methodologies using both industry and  internal tools

  • Perform technical evaluations of vendors and IP, providing recommendations and assessments to meet design specification

Preferred qualifications:

  • Bachelors in Electrical Engineering and 12+ years of experience in top level floorplannning  with a focus on die size estimate, partitioning, clocking and pin planning

  • Or Master's degree in Electrical Engineering and 10+ years of experience in top level floorplannning  with a focus on die size estimate, partitioning, clocking and pin planning

  • Experience working on various technologies (Switch Fabric, Arbiter, High Speed DDR, SerDes, HBM, D2D I/O, chiplet etc)

  • Experience in resolving chip level DRC/LVS/EMIR issues for advance nodes

  • Proven track record with bump planning, RDL implementation, and multi-voltage domain designs

  • Experience with hierarchical floorplanning,  power grid design, structured clocks, top level pipeline planning, custom routes and bump planning

  • Experience in collaborating with design, package and methodology teams during development phase

  • Experience in scripting languages like Python, Tcl, or Perl and EDA tools

  • Must work in person at our San Jose site and no remote work option

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $143,800 - $230,000

 

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Skills Required

  • In-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape-out
  • Bachelor's in Electrical Engineering with 12+ years OR Master's in Electrical Engineering with 10+ years (top-level floorplanning experience)
  • Extensive experience in top-level floorplanning: die size estimate, partitioning, clocking, and pin planning
  • Experience with switch fabric, arbiter, high-speed DDR, SerDes, HBM, D2D I/O, and chiplet technologies
  • Experience resolving chip-level DRC/LVS/EMIR issues for advanced nodes
  • Proven track record with bump planning, RDL implementation, and multi-voltage domain designs
  • Experience with hierarchical floorplanning, power grid design, structured clocks, top-level pipeline planning, and custom routes
  • Experience collaborating with design, package and methodology teams
  • Experience in scripting languages (Python, Tcl, or Perl) and familiarity with EDA tools
  • Must work in person at San Jose site; no remote work option

Broadcom Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.

  • Equity Value & Accessibility Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
  • Retirement Support A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
  • Pay Growth & Progression Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.

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The Company
HQ: Palo Alto, CA
38,985 Employees
Year Founded: 1991

What We Do

Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.

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