Responsibilities
Drive Technical Solutions: Lead the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes.
Provide Subject Matter Expertise: Serve as a technical expert on thermal management principles, material characterization, and high-performance diamond applications for both internal teams and external customers.
Bridge R&D and Customers: Collaborate closely with R&D and Product Development teams to translate customer feedback into product improvements, identify new application opportunities, and inform future product roadmaps.
Customer Integration & Support: Partner directly with semiconductor customers to understand their thermal challenges, guide product selection, and support integration from early-stage prototyping through qualified production.
Cross-Functional Execution: Work alongside manufacturing, reliability, and sales teams to ensure successful technology transfers, compliance demonstration, and customer success.
Requirements
Education & Experience: Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field, with 5+ years of hands-on experience in semiconductor packaging and/or thermal management applications.
Technical Depth: Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques (including 2.5D/3D IC thermal solutions).
Proven Execution: Demonstrated track record of hands-on development, integration, troubleshooting, and scaling concepts from R&D into mass production.
Industry Knowledge: Strong familiarity with systems engineering, high thermal conductivity materials, reliability and compliance demonstration, and technology transfer processes within the semiconductor ecosystem.
Communication & Ownership: Excellent communication, presentation, and interpersonal skills, with the ability to lead technical discussions, support business development, and work effectively across cross-functional teams.
Skills Required
- Bachelor's or Master's degree in Materials Science, Chemistry, Electrical or Mechanical Engineering or related field
- 5+ years hands-on experience in semiconductor packaging and/or thermal management applications
- Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques (including 2.5D/3D IC thermal solutions)
- Proven track record of hands-on development, integration, troubleshooting, and scaling concepts from R&D into mass production
- Familiarity with systems engineering, high thermal conductivity materials, reliability and compliance demonstration, and technology transfer processes
- Excellent communication, presentation, and interpersonal skills
What We Do
At Diamond Foundry, our mission is to create the future of diamond. We developed proprietary reactor technology capable of forming plasma as hot as the sun at unprecedented density to produce diamond at mining scale. In our zero-emission foundry, we sustainably create diamond for the jewelry and semiconductor industries. Our VRAI brand brings iconic innovation in diamond jewelry direct to consumers. For more information on how we’re creating the future, visit www.diamondfoundry.com. Fast Company World's Most Innovative Company TIME Best Inventions Business Insider’s 21 Most Innovative Tech Startups CNBC’s Top 50 Disruptors Inc’s 25 Most Disruptive Companies


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