Responsibilities
- Lead and grow the application engineering function focused on semiconductor packaging and thermal management applications.
- Drive the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes.
- Provide in-depth technical expertise on thermal management principles and material characterization.
- Collaborate with the R&D and product development teams to define product roadmaps, identify new application opportunities, and drive product improvements.
Requirements
- Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field with a minimum of 8+ years of experience in semiconductor packaging and/or thermal management applications.
- Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques, including advanced packaging basic understanding, including 2.5D/3D IC thermal solutions. Demonstration of exceptional ability and accomplishments, including hands-on development, integration, troubleshooting, and implementation of solutions. Ability to execute from concepts and R&D to scaling and mass production.
- Strong knowledge of the semiconductor industry, systems engineering, reliability and compliance demonstration, and technology transfers, particularly in advanced packaging and thermal management.
- Proven ability to lead and manage cross-functional engineering teams, coupled with excellent communication, presentation, and interpersonal skills to support both internal collaboration and external business development and customer engagement.
- Experience with high thermal conductivity materials and advanced packaging.
Skills Required
- Bachelor's or Master's degree in Materials Science, Chemistry, Electrical or Mechanical Engineering or related field
- Minimum 8+ years' experience in semiconductor packaging and/or thermal management applications
- Deep understanding of semiconductor packaging technologies including 2.5D/3D IC and advanced packaging
- Expertise in thermal management principles and material characterization techniques
- Hands-on development, integration, troubleshooting, and implementation from R&D to scaling and mass production
- Knowledge of systems engineering, reliability and compliance demonstration, and technology transfers
- Proven ability to lead and manage cross-functional engineering teams with strong communication and presentation skills
- Experience with high thermal conductivity materials and advanced packaging
What We Do
At Diamond Foundry, our mission is to create the future of diamond. We developed proprietary reactor technology capable of forming plasma as hot as the sun at unprecedented density to produce diamond at mining scale. In our zero-emission foundry, we sustainably create diamond for the jewelry and semiconductor industries. Our VRAI brand brings iconic innovation in diamond jewelry direct to consumers. For more information on how we’re creating the future, visit www.diamondfoundry.com. Fast Company World's Most Innovative Company TIME Best Inventions Business Insider’s 21 Most Innovative Tech Startups CNBC’s Top 50 Disruptors Inc’s 25 Most Disruptive Companies



