At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
Job title: SerDes Architecture and Modeling Engineer
Location : Lausanne, Switzerland
Responsibility:
Implement, document, and maintain software for system-level modelling of serial communication links in MATLAB, Python, and C++
Work closely with system architects in order to budget the link and define block-level specs of the transceiver
Work closely with analog, digital, and verification teams in order to support the design and verification process
Skills:
Good knowledge of control theory and digital algorithms
Demonstrated skills in implementing signal-processing algorithms
Understanding of the building blocks of a digital communication link and factors impacting the link performance (Familiarity with SerDes link components and clock recovery circuits is a plus)
Proficient in at least one of the following programming languages C++, MALTAB, or Python/NumPy.
Familiar with git version-control system and fundamentals of software engineering (unit-testing, profiling, …)
Familiar with analog circuit simulators (SPICE/SPECTRE)
Familiar with principles of signal integrity
Strong communication and presentation skills
Preferred Experience:
5+ years of experience in semiconductor, telecommunications, or mathematical/scientific software industry
Experience with system-level simulation of digital communication systems (experience in SerDes links is a plus)
Experience working with geographically dispersed teams
Education
Bachelor of Engineering in Electronics and Electrical Engineering, Communication Systems, or Computer Science (equivalent or higher) with strong background in Signal Processing and good understanding of Circuits Theory
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It !
Visit us at www.kandou.ai and https://www.linkedin.com/company/kandou-ai/
Skills Required
- Bachelor of Engineering in Electronics and Electrical Engineering, Communication Systems, Computer Science, or equivalent/higher education
- Strong background in signal processing
- Good understanding of circuit theory
- Knowledge of control theory and digital algorithms
- Demonstrated ability to implement signal-processing algorithms
- Understanding of digital communication link building blocks and performance factors
- Proficiency in at least one of C++, MATLAB, or Python/NumPy
- Familiarity with Git and software engineering fundamentals, including unit testing and profiling
- Familiarity with analog circuit simulators such as SPICE or SPECTRE
- Familiarity with signal integrity principles
- Strong communication and presentation skills
- Five or more years of experience in semiconductor, telecommunications, or mathematical/scientific software industries
- Experience with system-level simulation of digital communication systems
- Experience with SerDes links
- Experience working with geographically dispersed teams
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
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