At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
Job title: Analog Layout Engineer (Lead)
Location: EU/CH/UK
Responsibility
Position in custom layout and verification of analog circuits, cells, blocks, and IP for multi-Gigabit high speed chip to chip communication links (SerDes up to and beyond 28Gb/s and/or memory IO) in advanced semiconductor technology nodes
Layout and verification of very high-speed analog circuits
Interact closely with the design team to understand requirements and implement solutions
Support IP and chip level integration
Support and interact with customers on requirements, and IP delivery
Exposure to flip-chip package technologies
Experience
10-15 years of relevant experience.
Must have experience in custom analog layout of circuits and blocks for multi-Gigabit serial data-link transceivers or HF/RF circuits
Must have expertise in layout of high-speed/frequency circuits like amplifiers, oscillators, phase-locked loops, delay-locked loops, and other fundamental building blocks like biasing, buffers, regulators, filters, data converters, etc.
Understanding of layout approaches and techniques for high-speed circuits, matching constraints, minimization of parasitics, power grids and ESD requirements
Experience on modern semiconductor process technologies including 28nm, 14/16nm, 7nm
User of EDA tool for design and verification like Cadence Virtuoso, Spectre/HSpice, Calibre/PVS DRC/LVS, parasitics extraction and modelling, EM, and IR drop, ESD, etc.
Skills
Self-motivated, with strong sense of ownership and responsibility. Good communicator and team player
Manage workload and schedules and report to internal management team
Background in Semiconductor Physics
Education
Graduate in E.E.
Skills Required
- Experience in custom analog layout of circuits and blocks for multi-gigabit serial data-link transceivers or HF/RF circuits
- Expertise in layout of high-speed and high-frequency circuits, including amplifiers, oscillators, PLLs, DLLs, biasing, buffers, regulators, filters, and data converters
- Understanding of high-speed circuit layout techniques, matching constraints, parasitic minimization, power grids, and ESD requirements
- Experience with modern semiconductor process technologies, including 28nm, 14/16nm, and 7nm
- Experience using EDA design and verification tools such as Cadence Virtuoso, Spectre/HSpice, Calibre or PVS DRC/LVS, parasitic extraction and modeling, EM, and IR-drop analysis
- Background in semiconductor physics
- Graduate degree in electrical engineering
- Strong communication, teamwork, self-motivation, ownership, and responsibility
- Ability to manage workload and schedules and report to internal management
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
