Role and Responsibilities
- Roles and Responsibilities:
- Manage, hire, supervise and retain the analog team – for Chip Development
- Work with the IP engineering team to take the IP needed and make any customization needed for integration into the products being developed
- Evaluate and select the IP from third party vendors like PCIe, USB, JESD204C, MIPI, Ethernet PHY and integrate the IP into our chips
- Enable the analog engineers to develop necessary skills for the job
- Analyze functional and performance requirements and derive specifications
- Architect circuit solutions
- Perform schematic capture, simulation and key-element layout of cells, blocks, macros and entire devices
- Interface with other IC designers, package designers, characterization engineers, and operations to complete working designs, ensure testability, and validate finished silicon
- Work with Architect to set system level specifications
Qualifications and experience
- BSEE Required, MSEE Preferred
- Minimum 10 years in analog semiconductor industry
- Experience in leading a chip preferred
- EHF/mmWave design experience is a plus
- Design Experience with 22, 16, 12 and lower nodes
- Familiar with PAs, Modulators, LNAs, LOs, detectors, dividers, biasing
- Experience with one or two of high speed, high precision ADC design, Digital PLL, SerDes, VCO, PMU
- Experience with both frequency- and time-domain analysis and design techniques required
- Experience leading project teams and taping out complete products or test chips required
Expectations
- Make any (if needed customizations) to the internal and external Analog IP licensed for the chips we are going to develop.
- Evaluate the IP we have to license – like PCIe, LPDDR4, JESD 204C PHY
- Help develop any BIST
- DO the Full chip integration
- Help setup the AMS mixed signal full chip simulation environment
- Run a few of the simulations
- Help with the FC simulations debug
- Help close the timing issues if any come up and work with the PD person to resolve any SI issues.
Top Skills
What We Do
Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores in advanced FinFET nodes to 28nm, that enable differentiated systems-on-chip (SoCs) in applications ranging from 5G, wireline and optical communications, LiDAR, radar, networking, AI, image sensors, and IoT. Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few Msps to over 20 Gsps sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins, Colorado, Boston, Massachusetts and Bangalore, India.
