Essential Duties:
Contribute to the innovation and development of 2.5D & 3D semiconductor integration processes for RF and high-speed mixed-signal electronics applications
Focus on key areas such as RF electrical performance of components, thermal-mechanical constraints, manufacturability, and cost considerations
Support integration efforts from chip-level to package and PCB
Conduct analyses of potential approaches under guidance
Collaborate with technical teams across various domains
Participate in research and development projects, contributing to technical organization and reporting
Help build relationships with vendors and partner organizations
Contribute to the preparation of reports, journal papers, and presentations
Support the creation of work plans to meet project timelines and objectives
Required Skills:
Recent experience or coursework in semiconductor manufacturing processes and electronics packaging
Familiarity with design of experiments and analysis techniques related to electrical, mechanical, thermal, and chemical properties.
Ability to contribute to building vendor relationships and external partnerships
Some experience or coursework in organizing and contributing to research and development efforts, including presentations and proposals
Basic understanding of commercial packaging technology (e.g., ceramic, laminate chip-level packages, printed circuit boards) and integrated circuit processing techniques
Familiarity with material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques
Exposure to high-speed electrical characterization methods is a plus.
Proficiency in Microsoft Office tools (Word, Excel, PowerPoint) and ability to write clear reports.
Ability to work in a fast-paced, deadline-driven environment, both independently and as part of a team
Required Education:
B.S. degree in Electrical Engineering, Mechanical Engineering, Physics, or a related scientific discipline
M.S. preferred
Physical Requirements:
Comfortable using computers and engineering workstations and interacting with colleagues and vendors
Must be able to work in confined spaces and have good visual and hearing acuity
Special Requirements:
Current U.S. person status required
Ability to obtain and maintain a US government security clearance is desired.
Compensation:
The base salary range for this full-time position $76,530 - $93,320 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.
What the Team is Saying
What We Do
HRL Laboratories, LLC, Malibu, California, (hrl.com) pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers. As a private company owned jointly by Boeing and GM, HRL is a source of innovations that advance the state of the art in profound and far-reaching ways.
Why Work With Us
Our success is the result of our collaborative team of researchers, many of whom are the leading experts in their fields. Through their insights in support for our customers, we are finding the unique opportunities in technology.
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HRL Laboratories Offices
Hybrid Workspace
Employees engage in a combination of remote and on-site work.
Hybrid Policy is role specific.
