Advanced Package Design Senior Staff Engineer

Posted 17 Days Ago
Be an Early Applicant
Santa Clara, CA, USA
In-Office
141K-211K Annually
Senior level
Artificial Intelligence • Automotive • Semiconductor
We create custom semiconductor solutions that move, process, store, and secure data quickly and reliably.
The Role
Leads advanced high-speed IC package development for next-generation semiconductor products. Responsibilities include package floorplanning, netlist and BGA map development, signal and power integrity optimization, package technology evaluation, layout implementation, EM simulation, and cross-functional collaboration. The role supports manufacturability, reliability, performance, cost, and new product introduction while advancing 2.5D and 3D packaging technologies.
Summary Generated by Built In

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Group Description
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems.
Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell’s overall technology leadership.

What You Can Expect

Marvell's Central Engineering team is seeking a highly motivated High-Speed IC Package Development Engineer to develop advanced microelectronic packaging solutions for next-generation semiconductor products supporting 448 Gb/s data rates and beyond.

In this role, the engineer will lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition, while optimizing signal integrity, power integrity, performance, manufacturability, reliability, and cost.

The engineer will work closely with package operations teams to evaluate package technologies, drive layout implementation, and ensure designs meet product and manufacturing requirements. Partnering with marketing, system architects, and IC design teams, the engineer will define package requirements, develop achievable specifications, and contribute to the advancement of next-generation packaging technologies.

What We're Looking For

  • At least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 7+ years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5+ years of experience.
  • Experience with high-speed electronic packaging for digital and analog ICs, package floor planning, netlist, schematic and BGA map development.
  • Experience with 2.5D/3D package development.
  • Knowledge of packaging technologies, materials, package substrate design rules and assembly rules
  • Ability to manage package design and development involving various cross functional teams like IC physical layout teams, Analog and Digital designers, SI/PI teams, thermal-mechanical teams, assembly development, and marketing.
  • Experience with CPC/CPO connectors is highly desired.
  • Basic proficiency with IC package floor planning tools like integrated system planner (ISP) and layout tools like APD
  • Strong fundamentals in EM, transmission lines and microwave theory and experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity is highly desired
  • Power plane design, modeling and analysis using tools like PowerSI, SIwave is highly desired
  • Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
  • Track record of new product introduction from concept, through development and production is a plus.
  • A team player
  • Strong communication, presentation, and documentation skills

Expected Base Pay Range (USD)

141,150 - 211,400, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.

Additional Compensation and Benefit Elements 

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at [email protected].

Interview Integrity 

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

#LI-MM1

Skills Required

  • Bachelor’s degree in Computer Science, Electrical Engineering, or a related field plus 7+ years of related professional experience, or a Master’s degree and/or PhD plus 5+ years of experience
  • Experience with high-speed electronic packaging for digital and analog ICs
  • Experience with package floorplanning, netlist development, schematic development, and BGA map development
  • Experience with 2.5D and 3D package development
  • Knowledge of packaging technologies, materials, package substrate design rules, and assembly rules
  • Ability to manage package design and development across cross-functional IC, analog, digital, SI/PI, thermal-mechanical, assembly, and marketing teams
  • Proficiency with package floorplanning tools such as Integrated System Planner and layout tools such as APD
  • Strong fundamentals in electromagnetic theory, transmission lines, and microwave theory
  • Experience using 2D and 3D electromagnetic simulation tools such as Ansys HFSS, SI-Wave, or Cadence Clarity
  • Experience with power plane design, modeling, and analysis using tools such as PowerSI or SIwave
  • Ability to automate signal integrity, power integrity, and packaging activities using Python or similar scripting tools
  • Experience with CPC/CPO connectors
  • Track record of new product introduction from concept through development and production
  • Strong communication, presentation, and documentation skills
  • Ability to work effectively as a team player

Marvell Technology Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Marvell Technology and has not been reviewed or approved by Marvell Technology.

  • Equity Value & Accessibility — Equity appears to be a meaningful part of total rewards through RSUs and an ESPP with a 15% discount and lookback, which can materially raise overall compensation. Stock upside is positioned as a key differentiator when company performance is strong.
  • Parental & Family Support — Paid parental/bonding leave is described as substantial, with additional disability leave for birthing parents and a flexible return-to-work program. Family-care leave, generous bereavement provisions, and family-building support (e.g., adoption/surrogacy reimbursement) further strengthen the package.
  • Healthcare Strength — Medical coverage is presented as broad with multiple plan options and preventive care covered at 100% in-network, alongside dental, vision, and structured mental-health support. Additional programs like telehealth and specialized care partners add depth to the health offering.

Marvell Technology Insights

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The Company
HQ: Santa Clara, CA
6,500 Employees
Year Founded: 1995

What We Do

Marvell specializes in semiconductor solutions that power a wide range of industries, from data centers and 5G networks to AI, automotive, and storage applications. Our cutting-edge products are designed to meet the constantly evolving demands of a connected world, enabling faster, more efficient and more secure data processing and communication. With a focus on excellence and a commitment to advancing technology, we develop solutions that drive progress and transform industries.

Why Work With Us

Life at Marvell means being a part of new innovation and enduring technology; but it's also much more. Our diverse community is strengthened through cultural events, corporate gatherings and team-building activities, fostering collaboration and making work enjoyable. At Marvell, it's not just a job; it's an enriching, community-driven experience.

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