3D NAND TCAD Modeling Engineer

Reposted 14 Hours Ago
Be an Early Applicant
San Jose, CA, USA
Hybrid
159K-255K Annually
Senior level
Information Technology • Industrial • Manufacturing
The Role
Develop predictive TCAD models and simulation tools for 3D NAND cell arrays and CMOS devices. Collaborate with process and PI teams, design DOEs, correlate E-test data to inline parameters, and present modeling insights to engineering teams to overcome scaling challenges.
Summary Generated by Built In
Company Description

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Job Description

As a TCAD Modeling Engineer, you will employ techniques and theories from areas of computational geometry, semiconductor device, materials science and engineering to build predictive TCAD models and provide concrete insights and solutions in 3D NAND Cell Array and CMOS technology development. The candidate will need to be a collaboration role model, establishing strong technical and personal credibility, ensuring on-time project success through influencing and working with other organizations.

Key Responsibilities:

  • Develops and codes various software programs, algorithms, and computational modeling tools
  • Develops methods, processes, and systems for predictive TCAD simulations across NAND technology nodes to generate useful insights and solutions for overcoming scaling constraints in NAND Cell and CMOS devices.
  • Collaborates extensively with PI and process teams for TCAD model development & deployment, designs DOE, proposes and validates solutions.
  • Analyzes and correlates E-test data to inline parameters, identifies significant insights from data and models; interprets data from experiments and present analysis & insights to engineering teams and leader

Qualifications

Required:

  • BS, MS, or PhD in a related science or engineering discipline
  • 5~10 years of proven TCAD modeling experience in relevant technical areas
  • In-depth knowledge of semiconductor physics and scaling principles. Must understand NAND device physics.
  • Proficient with Synopsis process and device simulator tool suite
  • Experienced in computational geometry and structure modeling
  • Strong communication and collaboration skills to work effectively with cross-functional teams.

Preferred:

  • Expertise in stress simulation (S-Interconnect, ComSol) is a strong plus
  • Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking

Additional Information

Working Conditions: This position is primarily office-based. Some international travel is expected.

This position is also eligible to participate in Solidigm's restricted stock unit (RSU), restricted cash unit (RCU), and cash bonus programs. In addition, Solidigm offers a benefits package that includes medical, dental, vision, supplemental life and AD&D insurance; short- and long-term disability; healthcare and dependent care flexible spending accounts, and a company match on eligible 401(k) plan contributions.

The compensation range for this role is $159,360 - $255,000. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.

 

This role can report out of either San Jose CA or Rancho Cordova CA on a hybrid basis.

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Skills Required

  • BS, MS, or PhD in a related science or engineering discipline
  • 5-10 years of proven TCAD modeling experience in relevant technical areas
  • In-depth knowledge of semiconductor physics and scaling principles
  • Understanding of NAND device physics
  • Proficient with Synopsys process and device simulator tool suite
  • Experienced in computational geometry and structure modeling
  • Strong communication and collaboration skills for cross-functional teamwork
  • Expertise in stress simulation (S-Interconnect, ComSol)
  • Demonstrated technical leadership and creative problem-solving track record

Solidigm Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Solidigm and has not been reviewed or approved by Solidigm.

  • Equity Value & Accessibility Equity grants are available to all employees via a long‑term incentive plan, making ownership broadly accessible. RSUs are positioned as a core component of the total package.
  • Leave & Time Off Breadth Paid Flexible Time Off is offered to U.S. and international employees, indicating broad access to time away. A hybrid work model further supports practical time‑off flexibility.
  • Healthcare Strength U.S. medical options include PPO, HDHP, and HMO, with dental and vision coverage alongside wellness offerings. The breadth of plan types signals robust core healthcare support.

Solidigm Insights

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The Company
HQ: San Jose, CA
1,614 Employees

What We Do

Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Our origins reflect Intel’s longstanding innovation in memory products and SK hynix’s international leadership and scale in the semiconductor industry, Solidigm became a standalone U.S. subsidiary under SK hynix in December 2021. Headquartered in San Jose, CA, Solidigm is powered by the inventiveness of close to 2,000 employees in 20 locations around the world. For more information about Solidigm, please visit https://www.solidigmtechnology.com

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