The responsibility of this role is to develop firmware modules and services for Kandou’s Memory fabrics products
Firmware is responsible for implementing and supporting the major differentiating features of Kandou’ products.
Basic qualification
Strong academic and technical background in Electronics & Computer engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.
Experience developing firmware (Bare metal/RTOS) to execute in on-chip microcontrollers/processors
Minimum 8-15 years’ experience developing firmware for Server, Storage, and/or Networking SoC products
Required experience
Hands-on experience designing and developing embedded firmware for PCIe/CXL/NVME protocols with proficiency in C (preferred) or C++, including development of C-based SDKs.
Experience with RTOS/Zephyr OS firmware development and enablement
Familiar with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, DDR controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces
Work with various cross-functional groups such as architect, other development teams, QA/validation, product management and customer teams across various sites
Preferred experience
Experience with DDR controller, storage or SSD firmware, including NVMe, PCIe, CXL or flash management concepts.
Hands-on experience with simulation or virtual platform–based development (e.g., Renode, QEMU, or similar)
Skills Required
- Bachelor’s degree in Electrical Engineering or Computer Science
- Master’s degree in Electrical Engineering or Computer Science
- 8–15 years of firmware development experience for server, storage, or networking SoC products
- Experience developing bare-metal or RTOS firmware for on-chip microcontrollers or processors
- Hands-on embedded firmware development for PCIe, CXL, or NVMe protocols
- Proficiency in C or C++, including development of C-based SDKs
- RTOS or Zephyr OS firmware development and enablement experience
- Familiarity with PCIe, NVMe, DDR, AMBA, AHB, and on-chip memory interfaces
- Experience with DDR controller, storage or SSD firmware, NVMe, PCIe, CXL, or flash management concepts
- Experience with simulation or virtual platform development using Renode, QEMU, or similar tools
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
