Teams at Taara

Own and deliver custom analog/mixed-signal ASIC blocks for co-integrated electronic and photonic modules. Responsibilities include chip architecture, circuit design, verification, layout, tape-out, silicon bring-up, characterization, and system-level optimization. The role requires extensive commercial foundry tape-out experience, expertise in high-precision circuits and BCD technology, mixed-signal co-simulation, top-level ASIC ownership, and physical verification using DRC, LVS, PI, and SI tools.

Design, model, fabricate, and validate mechanical components for wireless optical communication terminals. Solve thermo-mechanical, environmental, materials, packaging, and thermal-management challenges; support photonics and precision steering integration; drive reliability testing; and help manufacturing partners ramp products to volume production.

Own the roadmap, requirements, prioritization, and user experience for customer-facing applications and embedded terminal software. Translate customer and technical needs into product specifications, user stories, and acceptance criteria; partner with engineering, UX, sales, marketing, and customer success to deliver releases. Use customer feedback, telemetry, usage data, and quality metrics to guide prioritization, measure outcomes, and improve software reliability, adoption, and usability.