Teams at SRI International

Designs and leads high-risk, high-impact deep-technology research programs with up to $30 million in funding. Selects and mentors multidisciplinary teams, manages multiple projects, makes go/no-go funding decisions, and engages industry, government, and academic stakeholders internationally, particularly in Japan. Focus areas include advanced connectivity, computing, AI, robotics, sensors, and digital twins.

Provides cradle-to-grave government contract negotiation and administration for proposals, contracts, OTAs, grants, and cooperative agreements. Reviews RFPs, identifies risks, ensures compliance with solicitation and regulatory requirements, negotiates terms, advises research and project teams, maintains client relationships, and signs proposals and contractual documents within established authority. The role requires extensive government contracting experience, knowledge of FAR and DFARS, and eligibility for a TS/SCI clearance.

Supports low-volume, high-mix microcircuit manufacturing through hands-on wafer fabrication process engineering. Responsibilities include sustaining, optimizing, integrating, and developing processes across deposition, etch, diffusion, wet chemistry, implantation, and related areas. The engineer investigates yield, defects, reliability, and process issues; collaborates with integration, design, and layout teams; and collects, analyzes, correlates, and presents process data. The role requires onsite cleanroom work and occasional flexible shifts.