Teams at RANOVUS Inc.

Leads semiconductor product characterization, yield analysis, statistical validation, DOE, GRR/MSA, test quality, and manufacturing readiness from NPI through high-volume production. Partners with design, test, fabs, foundries, OSATs, and operations to improve yield, process capability, product quality, test coverage, and production ramps. Supports wafer sort and final test, root-cause investigations, qualification, production release criteria, and continuous improvement.

Designs and optimizes PCB and substrate layouts for analog, digital, RF, and mixed-signal hardware. Collaborates with electrical, mechanical, signal integrity, packaging, and manufacturing teams to meet performance and manufacturability requirements. Produces Gerber files, fabrication drawings, and assembly documentation; performs DRC and ERC checks; applies IPC, UL, and RoHS standards; supports signal integrity, thermal management, vendor coordination, design reviews, and manufacturing issue resolution.

Designs, validates, debugs, and releases advanced hardware systems for semiconductor and data-center applications. Responsibilities include hardware architecture, circuit schematics, simulations, PCB stackups and layout coordination, high-speed RF and digital interface design, component engineering, signal integrity, thermal and EMI/EMC considerations, lab characterization, documentation, and mentoring junior engineers.